Bernin
France
41
2013-05-23
36
2013-08-27
These are the the leading inventors for applications assigned to S.O.I Tec Silicon on Insulator Technologies:
S.O.I Tec Silicon on Insulator Technologies based in Bernin, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Process of making semiconductor on glass substrates with a stiffening layer
#2 | 2013-03-28 ✅ Patent 8,628,674 granted on 2014-01-14Method for trimming a structure obtained by the assembly of two plates
#3 | 2012-04-03 ✅ Patent 8,148,252 granted on 2012-04-03Methods of forming III/V semiconductor materials, and semiconductor structures formed using such methods
#4 | 2012-03-15METHODS OF FORMING THROUGH WAFER INTERCONNECTS IN SEMICONDUCTOR STRUCTURES USING SACRIFICIAL MATERIAL, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
#5 | 2011-12-22 ✅ Patent 8,247,309 granted on 2012-08-21Controlled temperature implantation
#6 | 2011-10-20FINISHING METHOD FOR MANUFACTURING SUBSTRATES IN THE FIELD OF ELECTRONICS
#7 | 2011-09-22 ✅ Patent 8,357,589 granted on 2013-01-22Method of thinning a structure
#8 | 2011-07-07 ✅ Patent 8,871,607 granted on 2014-10-28Method for producing hybrid components
#9 | 2011-06-02 ✅ Patent 8,293,620 granted on 2012-10-23Method of making multiple implantations in a substrate
#10 | 2011-02-24METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUCTURES OBTAINED BY SUCH METHODS
#11 | 2011-02-10 ✅ Patent 8,693,835 granted on 2014-04-08Method for transferring a thin layer by proton exchange
#12 | 2011-01-20 ✅ Patent 8,535,996 granted on 2013-09-17Substrate having a charged zone in an insulating buried layer
#13 | 2010-12-02 ✅ Patent 8,420,500 granted on 2013-04-16Method of producing a structure by layer transfer
#14 | 2010-11-18 ✅ Patent 8,058,158 granted on 2011-11-15Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the same
#15 | 2010-10-21 ✅ Patent 8,084,784 granted on 2011-12-27Semiconductor heterostructure and method for forming same
#16 | 2010-10-14PROCESS FOR FABRICATING AN ELECTRONIC DEVICE
#17 | 2010-07-29 ✅ Patent 8,008,929 granted on 2011-08-30Method and apparatus for measuring a lifetime of charge carriers
#18 | 2010-04-22 ✅ Patent 8,343,850 granted on 2013-01-01Process for fabricating a substrate comprising a deposited buried oxide layer
#19 | 2010-03-04 ✅ Patent 7,947,571 granted on 2011-05-24Method for fabricating a semiconductor on insulator substrate with reduced Secco defect density
#20 | 2010-02-11 ✅ Patent 8,048,693 granted on 2011-11-01Methods and structures for relaxation of strained layers
#21 | 2010-02-04 ✅ Patent 8,105,916 granted on 2012-01-31Relaxation and transfer of strained layers
#22 | 2010-01-14 ✅ Patent 7,863,650 granted on 2011-01-04Multilayer structure and fabrication thereof
#23 | 2010-01-07 ✅ Patent 8,519,443 granted on 2013-08-27Method for making a heterojunction bipolar transistor
#24 | 2009-06-25 ✅ Patent 8,445,122 granted on 2013-05-21Data storage medium and associated method
#25 | 2009-03-05 ✅ Patent 7,670,930 granted on 2010-03-02Method of detaching a thin film by melting precipitates
#26 | 2009-02-26 ✅ Patent 7,846,816 granted on 2010-12-07Method for producing a multilayer structure comprising a separating layer
#27 | 2009-02-26 ✅ Patent 7,812,942 granted on 2010-10-12Method for detecting surface defects on a substrate and device using said method
#28 | 2008-12-11 ✅ Patent 7,695,996 granted on 2010-04-13Photodetecting device
#29 | 2008-10-02 ✅ Patent 7,871,900 granted on 2011-01-18Quality of a thin layer through high-temperature thermal annealing
#30 | 2008-08-14 ✅ Patent 7,611,974 granted on 2009-11-03Multilayer structure and fabrication thereof
#31 | 2008-07-10 ✅ Patent 7,534,701 granted on 2009-05-19Process for transferring a layer of strained semiconductor material
#32 | 2008-06-05 ✅ Patent 8,298,915 granted on 2012-10-30Method of transferring a circuit onto a ground plane
#33 | 2008-03-13TREATMENT OF SEMICONDUCTOR WAFERS
#34 | 2008-01-17 ✅ Patent 8,216,916 granted on 2012-07-10Treatment for bonding interface stabilization
#35 | 2008-01-17 ✅ Patent 7,670,929 granted on 2010-03-02Method for direct bonding two semiconductor substrates
#36 | 2007-06-14 ✅ Patent 7,645,486 granted on 2010-01-12Method of manufacturing a silicon dioxide layer
#37 | 2007-01-25 ✅ Patent 7,446,019 granted on 2008-11-04Method of reducing roughness of a thick insulating layer
#38 | 2006-10-12 ✅ Patent 7,232,739 granted on 2007-06-19Multifunctional metallic bonding
#39 | 2006-06-15 ✅ Patent 7,452,584 granted on 2008-11-18Method of increasing the area of a useful layer of material transferred onto a support
#40 | 2005-10-27 ✅ Patent 7,544,586 granted on 2009-06-09Method of fabricating chips and an associated support
#41 | 2005-07-07 ✅ Patent 7,772,087 granted on 2010-08-10Method of catastrophic transfer of a thin film after co-implantation
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