Kalispell, Montana
United States
110
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor McHugh Paul R.:
Paul R. McHugh from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#2 | 2025-12-11RAPID SEAL LEAK TEST USING HE OR CO2 GAS DETECTION
#3 | 2025-11-13COPLANARITY IMPROVEMENT OF HIGH-RATE CU PILLAR PROCESSES USING HIGH AGITATION TO ENABLE USE OF HIGH ACID, LOW CU CHEMISTRIES
#4 | 2025-11-13ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
#5 | 2025-10-30GAS ATOMIZED PREWETTING CHAMBER AND CLEANING SYSTEM AND METHOD
#6 | 2025-06-12FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING
#7 | 2025-04-10ANNEAL CHAMBER
#8 | 2025-04-10ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
#9 | 2025-02-13PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICONDUCTOR PLATING PROCESSES
#10 | 2025-01-02ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#11 | 2024-12-12AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAFER RESULTS FROM EX-SITU METROLOGY
#12 | 2023-12-21MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES
#13 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#14 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#15 | 2023-09-07Plating and deplating currents for material co-planarity in semiconductor plating processes
#16 | 2023-08-17Parameter adjustment model for semiconductor processing chambers
#17 | 2023-06-22Mechanically-driven oscillating flow agitation
#18 | 2023-06-01Electroplating system
#19 | 2023-03-23ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
#20 | 2022-05-12Electroplating system
#21 | 2022-05-12Mechanically-driven oscillating flow agitation
#22 | 2022-04-28Multi-compartment electrochemical replenishment cell
#23 | 2021-11-11Electroplating system
#24 | 2021-04-08Mechanically-driven oscillating flow agitation
#25 | 2019-05-23Electroplating apparatus with electrolyte agitation
#26 | 2017-12-21WAFER PROCESSOR DOOR INTERFACE
#27 | 2017-12-14Removing photoresist from a wafer
#28 | 2017-11-23Electroplating apparatus with current crowding adapted contact ring seal and thief electrode
#29 | 2017-10-05Electroplating wafers having a pattern induced non-uniformity
#30 | 2017-05-18Inert anode electroplating processor and replenisher with anionic membranes
#31 | 2017-03-02Electroplating processor with current thief electrode
#32 | 2017-02-23Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
#33 | 2017-01-26Electroplating apparatus with electrolyte agitation
#34 | 2017-01-19Inert anode electroplating processor and replenisher
#35 | 2017-01-12Electroplating apparatus with membrane tube shield
#36 | 2016-12-08METHOD OF FORMING METAL AND METAL ALLOY FEATURES
#37 | 2016-12-01Electroplating apparatus
#38 | 2016-10-20Electroplating wafers having a notch
#39 | 2016-08-18ELECTROPLATING WITH REDUCED AIR BUBBLE DEFECTS
#40 | 2016-07-28Electroplating apparatus with notch adapted contact ring seal and thief electrode
#41 | 2016-07-21Electroplating apparatus with membrane tube shield
#42 | 2015-03-19ELECTROPLATING PROCESSOR WITH GEOMETRIC ELECTROLYTE FLOW PATH
#43 | 2014-12-18AUTOMATIC IN-SITU CONTROL OF AN ELECTRO-PLATING PROCESSOR
#44 | 2014-09-18DETECTING ELECTROLYTE MENISCUS IN ELECTROPLATING PROCESSORS
#45 | 2014-03-06Electroplating systems and methods for high sheet resistance substrates
#46 | 2013-11-14Electrochemical processor
#47 | 2013-11-14Electroplating processor with geometric electrolyte flow path
#48 | 2013-06-13Electro processor with shielded contact ring
#49 | 2013-05-30Contact ring for an electrochemical processor
#50 | 2013-03-28APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS
#51 | 2012-11-22Electrochemical processor
#52 | 2012-11-22Electrochemical processor
#53 | 2012-08-09PROCESSING APPARATUS WITH VERTICAL LIQUID AGITATION
#54 | 2012-03-01WORKPIECE WETTING AND CLEANING
#55 | 2010-05-13Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#56 | 2010-04-01Electro-chemical processor
#57 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#58 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES
#59 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#60 | 2008-07-31Apparatus and methods for electrochemical processing of microfeature wafers
#61 | 2008-07-01Integrated microfeature workpiece processing tools with registration systems for paddle reactors
#62 | 2008-03-20Method of forming metal and metal alloy features
#63 | 2008-02-28Electro-chemical processor
#64 | 2008-02-21Method and system for depositing alloy composition
#65 | 2008-01-17Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#66 | 2008-01-17Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
#67 | 2008-01-10Thermal wafer processor
#68 | 2008-01-03Electro-chemical processor
#69 | 2007-11-15Reactors, systems, and methods for electroplating microfeature workpieces
#70 | 2007-09-27TUNING ELECTRODES USED IN A REACTOR FOR ELECTROCHEMICALLY PROCESSING A MICROELECTRONIC WORKPIECE
#71 | 2007-09-11Workpiece processor having processing chamber with improved processing fluid flow
#72 | 2007-09-04Apparatus and methods for electrochemical processing of microelectronic workpieces
#73 | 2007-08-07Apparatus and method for thermally controlled processing of microelectronic workpieces
#74 | 2007-07-24Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#75 | 2007-07-05Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
#76 | 2007-04-26Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#77 | 2007-03-13Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#78 | 2007-02-15Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#79 | 2007-01-09Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#80 | 2006-10-12Die-level wafer contact for direct-on-barrier plating
#81 | 2006-10-03Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#82 | 2006-09-05Methods and apparatus for processing microelectronic workpieces using metrology
#83 | 2006-03-28Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#84 | 2006-01-05Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#85 | 2005-11-03Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#86 | 2005-10-13System for electrochemically processing a workpiece
#87 | 2005-09-29Apparatus and methods for electrochemical processing of microelectronic workpieces
#88 | 2005-09-22Apparatus and methods for electrochemical processsing of microelectronic workpieces
#89 | 2005-09-22Apparatus and methods for electrochemical processing of microelectronic workpieces
#90 | 2005-09-08Apparatus and methods for electrochemical processing of microelectronic workpieces
#91 | 2005-09-01Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#92 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#93 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#94 | 2005-08-25Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
#95 | 2005-08-18Method and systems for controlling current in electrochemical processing of microelectronic workpieces
#96 | 2005-08-04Tuning electrodes used in a reactor for electrochemically processing a microelectronics workpiece
#97 | 2005-08-04Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#98 | 2005-08-04System for electrochemically processing a workpiece
#99 | 2005-05-26System for electrochemically processing a workpiece
#100 | 2005-05-26System for electrochemically processing a workpiece
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