Kalispell, Montana
United States
55
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor Bergman Eric J.:
Eric J. Bergman from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#2 | 2025-04-10ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
#3 | 2025-01-02ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#4 | 2024-07-04ELECTROLESS PLATING WITH A FLOATING POTENTIAL
#5 | 2023-08-31ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
#6 | 2023-08-17Parameter adjustment model for semiconductor processing chambers
#7 | 2023-06-01Electroplating system
#8 | 2023-03-30WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
#9 | 2023-03-16Diffusion layers in metal interconnects
#10 | 2023-03-02Electrochemical depositions of nanotwin copper materials
#11 | 2023-03-02Electrochemical depositions of ruthenium-containing materials
#12 | 2023-03-02Nanotwin copper materials in semiconductor devices
#13 | 2022-09-08Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
#14 | 2022-08-18Fluid recovery in semiconductor processing
#15 | 2022-05-12Electroplating system
#16 | 2022-05-12Glass carrier cleaning using ozone
#17 | 2022-03-10Spent dialysate container for disposing spent dialysate in a dialysis system
#18 | 2021-11-11Electroplating system
#19 | 2021-01-21Fluid recovery in semiconductor processing
#20 | 2020-12-24Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
#21 | 2020-10-29Dialysis machine tubing protection
#22 | 2019-10-24Cleaning components and methods in a plating system
#23 | 2019-10-03Substrate cleaning components and methods in a plating system
#24 | 2019-08-01Systems and methods for copper (I) suppression in electrochemical deposition
#25 | 2019-07-11Techniques for improved removal of sacrificial mask
#26 | 2019-01-17Controlled etch of nitride features
#27 | 2018-06-19Methods for chemical mechanical polishing (CMP) processing with ozone
#28 | 2018-05-24Drying high aspect ratio features
#29 | 2018-01-18Drying high aspect ratio features
#30 | 2017-12-14Removing photoresist from a wafer
#31 | 2017-07-06Systems and methods for shielding features of a workpiece during electrochemical deposition
#32 | 2017-02-23Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
#33 | 2016-11-17METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION
#34 | 2012-11-15SELECTIVE SILICON NITRIDE ETCH
#35 | 2011-10-04Wafer handling system
#36 | 2011-09-08PHOTORESIST REMOVING PROCESSOR AND METHODS
#37 | 2008-08-26Process and apparatus for treating a workpiece with gases
#38 | 2008-07-29Methods of thinning a silicon wafer using HF and ozone
#39 | 2007-10-09Vapor phase etching MEMS devices
#40 | 2007-10-04METHODS FOR REMOVING PHOTORESIST
#41 | 2007-09-04Process and apparatus for treating a workpiece using ozone
#42 | 2006-08-10METHODS FOR FORMING THIN OXIDE LAYERS ON SEMICONDUCTOR WAFERS
#43 | 2006-07-13Workpiece processing using ozone gas and chelating agents
#44 | 2006-06-29Workpiece processing using ozone gas and solvents
#45 | 2006-06-08Cleaning with electrically charged aerosols
#46 | 2005-10-27System and methods for polishing a wafer
#47 | 2005-09-29System and methods for etching a silicon wafer using HF and ozone
#48 | 2005-09-08Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive
#49 | 2005-06-23Processing a workpiece using water, a base, and ozone
#50 | 2005-04-07Process and apparatus for treating a workpiece
#51 | 2005-03-22Methods for removing metallic contamination from wafer containers
#52 | 2005-03-22Process and apparatus for treating a workpiece such as a semiconductor wafer
#53 | 2005-02-17Processing a workpiece with ozone and a halogenated additive
#54 | 2005-01-18Methods for cleaning semiconductor surfaces
#55 | 2005-01-04Apparatus for treating a workpiece with steam and ozone
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