Mountain View, California
United States
53
2019-01-31
The entities that hold a legal rights for patent applications filed by inventor Lambrecht Frank:
Frank Lambrecht from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#2 | 2018-11-15Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#3 | 2017-09-07Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#4 | 2017-03-23STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
#5 | 2017-03-02Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#6 | 2016-09-22Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
#7 | 2016-09-15Stub minimization for assemblies without wirebonds to package substrate
#8 | 2016-07-07Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis
#9 | 2016-06-30Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
#10 | 2016-03-31Stub minimization using duplicate sets of signal terminals
#11 | 2015-10-15Drift tracking feedback for communication channels
#12 | 2015-08-06Multiple die face-down stacking for two or more die
#13 | 2015-07-16Stub minimization for multi-die wirebond assemblies with parallel windows
#14 | 2014-11-06Stub minimization for multi-die wirebond assemblies with parallel windows
#15 | 2014-11-06Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows
#16 | 2014-07-03Drift tracking feedback for communication channels
#17 | 2014-07-03Stub minimization using duplicate sets of signal terminals
#18 | 2014-06-19Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate
#19 | 2014-06-19Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows
#20 | 2014-04-17Stub minimization for assemblies without wirebonds to package substrate
#21 | 2013-11-28Semiconductor module with micro-buffers
#22 | 2013-10-31Stub minimization using duplicate sets of signal terminals
#23 | 2013-05-23Multiple die face-down stacking for two or more die
#24 | 2013-04-04Stub minimization for multi-die wirebond assemblies with parallel windows
#25 | 2013-04-04Stub minimization for assemblies without wirebonds to package substrate
#26 | 2013-04-04Stub minimization for wirebond assemblies without windows
#27 | 2013-04-04Stub minimization for wirebond assemblies without windows
#28 | 2013-04-04Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#29 | 2013-04-04Stub minimization for wirebond assemblies without windows
#30 | 2013-04-04Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#31 | 2013-04-04Stub minimization for assemblies without wirebonds to package substrate
#32 | 2013-04-04Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#33 | 2013-04-04Stub minimization for assemblies without wirebonds to package substrate
#34 | 2013-04-04Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#35 | 2012-07-19Semiconductor module with micro-buffers
#36 | 2011-10-20Apparatus for data recovery in a synchronous chip-to-chip system
#37 | 2011-05-19DETACHABLE INTERCONNECT FOR CONFIGURABLE WIDTH MEMORY SYSTEM
#38 | 2011-01-13Displacement sensing using a flexible substrate
#39 | 2010-09-23Antenna array with flexible interconnect for a mobile wireless device
#40 | 2010-04-01Semiconductor module with micro-buffers
#41 | 2010-03-25Apparatus for data recovery in a synchronous chip-to-chip system
#42 | 2010-03-04Drift tracking feedback for communication channels
#43 | 2009-07-23Technique for low-power operation of a wireless device
#44 | 2008-07-31Apparatus for data recovery in a synchronous chip-to-chip system
#45 | 2008-03-25Apparatus for data recovery in a synchronous chip-to-chip system
#46 | 2007-08-30Drift tracking feedback for communication channels
#47 | 2007-04-19Drift tracking feedback for communication channels
#48 | 2006-06-29Circuits, systems and methods for dynamic reference voltage calibration
#49 | 2006-06-29Circuits, systems and methods for dynamic reference voltage calibration
#50 | 2006-02-09Drift tracking feedback for communication channels
#51 | 2005-09-22Drift tracking feedback for communication channels
#52 | 2005-04-19Adjustable clock driver circuit
#53 | 2005-01-06Technique for determining performance characteristics of electronic systems
173128 ⎘