Cedar Creek, Texas
United States
40
2025-03-20
The entities that hold a legal rights for patent applications filed by inventor Dip Anthony:
Anthony Dip from Cedar Creek, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SHOWERHEAD FOR PROCESS TOOL
#2 | 2022-03-31Multiple zone gas injection for control of gas phase radicals
#3 | 2021-12-30Showerhead for process tool
#4 | 2021-12-23Spatial atomic layer deposition
#5 | 2021-12-23System and Method for Thermally Cracking Ammonia
#6 | 2019-11-28Multiple zone gas injection for control of gas phase radicals
#7 | 2017-08-17Method and apparatus for multi-film deposition and etching in a batch processing system
#8 | 2012-01-05Method of forming strained epitaxial carbon-doped silicon films
#9 | 2011-10-06Multilayer sidewall spacer for seam protection of a patterned structure
#10 | 2011-10-06Dual sidewall spacer for seam protection of a patterned structure
#11 | 2011-08-09Low-temperature dielectric film formation by chemical vapor deposition
#12 | 2009-10-01In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition
#13 | 2009-04-02Method for growing an oxynitride film on a substrate
#14 | 2009-02-05THERMAL PROCESSING SYSTEM AND METHOD FOR FORMING AN OXIDE LAYER ON SUBSTRATES
#15 | 2008-10-02Method for growing a thin oxynitride film on a substrate
#16 | 2008-08-14Atomic layer deposition systems and methods
#17 | 2008-07-17Reduced defect silicon or silicon germanium deposition in micro-features
#18 | 2008-02-14Thermal processing system with improved process gas flow and method for injecting a process gas into a thermal processing system
#19 | 2007-11-08In-situ formation of oxidized aluminum nitride films
#20 | 2007-10-11Method for replacing a nitrous oxide based oxidation process with a nitric oxide based oxidation process for substrate processing
#21 | 2007-10-11Sequential oxide removal using fluorine and hydrogen
#22 | 2007-10-04Thermal processing furnace, gas delivery system therefor, and methods for delivering a process gas thereto
#23 | 2007-03-01Interrupted deposition process for selective deposition of Si-containing films
#24 | 2007-02-22Sequential deposition process for forming Si-containing films
#25 | 2007-02-22Low temperature formation of patterned epitaxial Si containing films
#26 | 2007-02-22Low-temperature oxide removal using fluorine
#27 | 2007-02-15IN-SITU ATOMIC LAYER DEPOSITION
#28 | 2007-01-16Built-in self test for a thermal processing system
#29 | 2006-10-12Method and system for removing an oxide from a substrate
#30 | 2006-07-20Micro-feature fill process and apparatus using hexachlorodisilane or other chlorine-containing silicon precursor
#31 | 2006-04-04Semiconductor wafer susceptor
#32 | 2005-10-06Method for extending time between chamber cleaning processes
#33 | 2005-10-06Wafer heater assembly
#34 | 2005-09-15Silicon germanium surface layer for high-k dielectric integration
#35 | 2005-09-15Silicon-germanium thin layer semiconductor structure with variable silicon-germanium composition and method of fabrication
#36 | 2005-03-31Deposition of silicon-containing films from hexachlorodisilane
#37 | 2005-03-22Method of oxidizing work pieces and oxidation system
#38 | 2005-03-03Multiple grow-etch cyclic surface treatment for substrate preparation
#39 | 2005-02-03Method of forming uniform ultra-thin oxynitride layers
#40 | 2005-02-03Formation of ultra-thin oxide layers by self-limiting interfacial oxidation
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