Timothy D. Sullivan

Centering substrates on a chuck

Electromigration monitor

Electromigration monitor

Solder bump array probe tip structure for laser cleaning

Chip joining by induction heating

Centering substrates on a chuck

Extrusion-resistant solder interconnect structures and methods of forming

Three-dimensional integrated circuit integration

IC structure with recessed solder bump area and methods of forming same

Three-dimensional integrated circuit integration

Programmable electrical fuse in keep out zone

Preventing misshaped solder balls

Electromigration monitor

Solder bump array probe tip structure for laser cleaning

Solder bump reflow by induction heating

Controlled metal extrusion opening in semiconductor structure and method of forming

Reducing thermal energy transfer during chip-join processing

Apparatus and method for centering substrates on a chuck

Method and apparatus for detecting foreign material on a chuck

Handle wafer

Integrated circuit structure with through-semiconductor via

Integrated circuit structure with metal cap and methods of fabrication

Structure to prevent solder extrusion

Chip joining by induction heating

PREVENTING MISSHAPED SOLDER BALLS

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Structures and methods for improving solder bump connections in semiconductor devices

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Semiconductor devices with enhanced electromigration performance

Semiconductor structures and methods of manufacture

Uniform roughness on backside of a wafer

Dice before grind with backside metal

Semiconductor structures with metal lines

Controlled metal extrusion opening in semiconductor structure and method of forming

Thermal via for 3D integrated circuits structures

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package

Extrusion-resistant solder interconnect structures and methods of forming

Structure and method to ensure correct operation of an integrated circuit in the presence of ionizing radiation

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Semiconductor structures and methods of manufacture

Structures and methods to reduce maximum current density in a solder ball

Self-aligned polymer passivation/aluminum pad

Inductors and wiring structures fabricated with limited wiring material

On-chip poly-to-contact process monitoring and reliability evaluation system and method of use

Underfill flow guide structures and method of using same

Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump

Solder interconnect pads with current spreading layers

Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture

Wiring structure and method of forming the structure

Buffer pad in solder bump connections and methods of manufacture

Polymer and solder pillars for connecting chip and carrier

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture

Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture

Offset solder vias, methods of manufacturing and design structures

Solder interconnect pads with current spreading layers

Array of alpha particle sensors

Electromigration resistant via-to-line interconnect

Underfill flow guide structures and method of using same

Metal wiring structures for uniform current density in C4 balls

Micro-electro-mechanical-system temperature sensor

Chip package solder interconnect formed by surface tension

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

Electromigration resistant aluminum-based metal interconnect structure

Structures and methods to reduce maximum current density in a solder ball

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods to improve lead-free C4 interconnect reliability

Solder interconnect pads with current spreading layers

Metal wiring structures for uniform current density in C4 balls

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Electromigration resistant aluminum-based metal interconnect structure

Array of alpha particle sensors

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Underfill flow guide structures

Combination via and pad structure for improved solder bump electromigration characteristics

Design structure for alpha particle sensor in SOI technology and structure thereof

TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERCONNECT STRUCTURE

Solder interconnect pads with current spreading layers

Design structure for semiconductor on-chip repair scheme for negative bias temperature instability

Semiconductor on-chip repair scheme for negative bias temperature instability

Method for detecting alpha particles in SOI technology

IC chip stress testing

Structure for modeling stress-induced degradation of conductive interconnects

Structure for monitoring stress-induced degradation of conductive interconnects

Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime

Dual-damascene metallization interconnection

Structure and method for monitoring stress-induced degradation of conductive interconnects

Dual damascene multi-level metallization

Optoelectronic memory devices

Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing

Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof

Trench type buried on-chip precision programmable resistor

Enhancement of performance of a conductive wire in a multilayered substrate

Enhancement of performance of a conductive wire in a multilayered substrate