Thomas H. Osterheld

ENHANCED SILICON GRIND USING CHEMICAL ADDITIVES IN FLUID DURING GRINDING PROCESS

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBSTRATE PRECESSION

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

CARRIER HEAD ACOUSTIC MONITORING WITH SENSOR IN PLATEN

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

MONITORING THICKNESS IN FACE-UP POLISHING

ACOUSTIC MONITORING OF CONDITIONER DURING POLISHING

MONITORING OF ACOUSTIC EVENTS ON A SUBSTRATE

DETERMINING SUBSTRATE PRECESSION WITH ACOUSTIC SIGNALS

DETERMINING SUBSTRATE ORIENTATION WITH ACOUSTIC SIGNALS

ACOUSTIC MONITORING OF CMP RETAINING RING

MONITORING OF POLISHING PAD TEXTURE IN CHEMICAL MECHANICAL POLISHING

Training spectrum generation for machine learning system for spectrographic monitoring

Consumable part monitoring in chemical mechanical polisher

Machine vision as input to a CMP process control algorithm

ACOUSTIC WINDOW WITH LIQUID-FILLED PORES FOR CHEMICAL MECHANICAL POLISHING AND METHODS OF FORMING PADS

CHEMICAL MECHANICAL POLISHING VIBRATION MEASUREMENT USING OPTICAL SENSOR

DETECTION OF PLANARIZATION FROM ACOUSTIC SIGNAL DURING CHEMICAL MECHANICAL POLISHING

ACOUSTIC WINDOW IN PAD BACKING LAYER FOR CHEMICAL MECHANICAL POLISHING

ACOUSTIC WINDOW IN PAD POLISHING AND BACKING LAYER FOR CHEMICAL MECHANICAL POLISHING

COUPLING OF ACOUSTIC SENSOR FOR CHEMICAL MECHANICAL POLISHING

Polishing system with annular platen or polishing pad

MONITOR CHEMICAL MECHANICAL POLISHING PROCESS USING MACHINE LEARNING BASED PROCESSING OF HEAT IMAGES

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBSTRATE PRECESSION

ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING

PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHANICAL POLISHING

Control of processing parameters for substrate polishing with angularly distributed zones using cost function

Imaging for monitoring thickness in a substrate cleaning system

Monitoring of polishing pad texture in chemical mechanical polishing

Polishing system with support post and annular platen or polishing pad

Machine vision as input to a CMP process control algorithm

Chemical mechanical polishing apparatus and methods

Training spectrum generation for machine learning system for spectrographic monitoring

Training spectrum generation for machine learning system for spectrographic monitoring

Consumable part monitoring in chemical mechanical polisher

Monitoring of vibrations during chemical mechanical polishing

Polishing system with annular platen or polishing pad for substrate monitoring

Chemical mechanical polishing automated recipe generation

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS

Chemical mechanical polishing apparatus and methods

Textured small pad for chemical mechanical polishing

Acoustic emission monitoring and endpoint for chemical mechanical polishing

Multi-Platen Multi-Head Polishing Architecture

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS

METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS

PAD CONDITIONING PROCESS CONTROL USING LASER CONDITIONING

Dynamic residue clearing control with in-situ profile control (ISPC)

DETERMINATION OF WAFER ANGULAR POSITION FOR IN-SEQUENCE METROLOGY

FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA

Path for probe of spectrographic metrology system

Weighted regression of thickness maps from spectral data

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS

Polishing System with In-Sequence Sensor

Multi-platen multi-head polishing architecture

Endpointing with selective spectral monitoring

Temperature control of chemical mechanical polishing

Thin polishing pad with window and molding process

Retaining ring for chemical mechanical polishing

Retaining ring monitoring and control of pressure

ENGINEERING DIELECTRIC FILMS FOR CMP STOP

BRUSH BOX MODULE FOR CHEMICAL MECHANICAL POLISHING CLEANER

Method of assembly of retaining ring for CMP

Selecting reference libraries for monitoring of multiple zones on a substrate

REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME

Multilayer retaining ring for chemical mechanical polishing

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

Polishing pad and system with window support

ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING

Endpoint control of multiple-wafer chemical mechanical polishing

Eddy current gain compensation

Use of pad conditioning in temperature controlled CMP

ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA

Multilayer retaining ring for chemical mechanical polishing

Methods for a multilayer retaining ring

Carrier head with a multilayer retaining ring for chemical mechanical polishing

Thin polishing pad with window and molding process

Pad conditioner

Polishing processes for shallow trench isolation substrates

Profile control platen

Chemical mechanical polishing a substrate having a filler layer and a stop layer

Profile control platen

Chemical mechanical polishing a substrate having a filler layer and a stop layer

Carrier head with a modified flexible membrane