Santa Clara, California
United States
42
2015-10-15
41
2017-08-29
These are the the leading inventors for applications assigned to Applied Materials:
Applied Materials based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Light wave separation lattices and methods of forming light wave separation lattices
#2 | 2012-03-22 ✅ Patent 8,492,284 granted on 2013-07-23Low temperature etchant for treatment of silicon-containing surfaces
#3 | 2010-03-04 ✅ Patent 8,369,978 granted on 2013-02-05Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
#4 | 2010-01-28 ✅ Patent 8,387,557 granted on 2013-03-05Method for forming silicon-containing materials during a photoexcitation deposition process
#5 | 2007-10-18 ✅ Patent 7,470,599 granted on 2008-12-30Dual-side epitaxy processes for production of nitride semiconductor structures
#6 | 2007-06-14 ✅ Patent 7,678,662 granted on 2010-03-16Memory cell having stressed layers
#7 | 2007-04-05In-situ substrate imaging
#8 | 2006-09-12 ✅ Patent 7,105,460 granted on 2006-09-12Nitrogen-free dielectric anti-reflective coating and hardmask
#9 | 2006-09-05 ✅ Patent 7,101,252 granted on 2006-09-05Polishing method and apparatus
#10 | 2006-08-08 ✅ Patent 7,086,929 granted on 2006-08-08Endpoint detection with multiple light beams
#11 | 2006-07-11 ✅ Patent 7,074,109 granted on 2006-07-11Chemical mechanical polishing control system and method
#12 | 2006-07-11 ✅ Patent 7,074,298 granted on 2006-07-11High density plasma CVD chamber
#13 | 2006-06-20 ✅ Patent 7,063,597 granted on 2006-06-20Polishing processes for shallow trench isolation substrates
#14 | 2006-06-20 ✅ Patent 7,063,455 granted on 2006-06-20Chemical dilution system for semiconductor device processing system
#15 | 2006-06-13 ✅ Patent 7,059,948 granted on 2006-06-13Articles for polishing semiconductor substrates
#16 | 2006-06-13 ✅ Patent 7,060,234 granted on 2006-06-13Process and apparatus for abatement of by products generated from deposition processes and cleaning of deposition chambers
#17 | 2006-06-06 ✅ Patent 7,055,809 granted on 2006-06-06Vaporizing reactant liquids for chemical vapor deposition film processing
#18 | 2006-06-06 ✅ Patent 7,055,808 granted on 2006-06-06Vaporizing reactant liquids for chemical vapor deposition film processing
#19 | 2006-05-30 ✅ Patent 7,052,552 granted on 2006-05-30Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD
#20 | 2006-05-23 ✅ Patent 7,048,607 granted on 2006-05-23System and method for chemical mechanical planarization
#21 | 2006-05-09 ✅ Patent 7,042,558 granted on 2006-05-09Eddy-optic sensor for object inspection
#22 | 2006-04-11 ✅ Patent 7,025,861 granted on 2006-04-11Contact plating apparatus
#23 | 2006-04-11 ✅ Patent 7,025,862 granted on 2006-04-11Plating uniformity control by contact ring shaping
#24 | 2006-03-02 ✅ Patent 7,087,536 granted on 2006-08-08Silicon oxide gapfill deposition using liquid precursors
#25 | 2006-01-26 ✅ Patent 7,081,042 granted on 2006-07-25Substrate removal from polishing tool
#26 | 2005-12-15 ✅ Patent 7,096,085 granted on 2006-08-22Process control by distinguishing a white noise component of a process variance
#27 | 2005-12-15 ✅ Patent 7,033,945 granted on 2006-04-25Gap filling with a composite layer
#28 | 2005-12-08 ✅ Patent 7,063,749 granted on 2006-06-20Scrubber with sonic nozzle
#29 | 2005-09-29 ✅ Patent 7,060,638 granted on 2006-06-13Method of forming low dielectric constant porous films
#30 | 2005-09-22 ✅ Patent 7,040,956 granted on 2006-05-09Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
#31 | 2005-09-08 ✅ Patent 7,087,497 granted on 2006-08-08Low-thermal-budget gapfill process
#32 | 2005-09-08 ✅ Patent 7,049,612 granted on 2006-05-23Electron beam treatment apparatus
#33 | 2005-08-18 ✅ Patent 7,070,475 granted on 2006-07-04Process control in electrochemically assisted planarization
#34 | 2005-08-11 ✅ Patent 7,044,832 granted on 2006-05-16Load cup for chemical mechanical polishing
#35 | 2005-08-04 ✅ Patent 7,064,078 granted on 2006-06-20Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme
#36 | 2005-07-28 ✅ Patent 7,049,211 granted on 2006-05-23In-situ-etch-assisted HDP deposition using SiF
#37 | 2005-07-14 ✅ Patent 7,094,710 granted on 2006-08-22Very low dielectric constant plasma-enhanced CVD films
#38 | 2005-05-12 ✅ Patent 7,205,205 granted on 2007-04-17Ramp temperature techniques for improved mean wafer before clean
#39 | 2005-04-14 ✅ Patent 7,064,077 granted on 2006-06-20Method for high aspect ratio HDP CVD gapfill
#40 | 2005-02-24 ✅ Patent 7,091,137 granted on 2006-08-15Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
#41 | 2005-02-24 ✅ Patent 7,040,966 granted on 2006-05-09Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers
#42 | 2005-02-24 ✅ Patent 7,049,249 granted on 2006-05-23Method of improving stability in low k barrier layers
Also check out Applied Materials' (Santa Clara, United States) applicant profile with 2 patent applications submitted.
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