Assignee profile:

Applied Materials

City:

Santa Clara, California

Country:

United States

Published Applications:

42

Last publication date:

2015-10-15

Patent Grants:

41

Last grant date:

2017-08-29

Top Inventors for applications by Applied Materials

These are the the leading inventors for applications assigned to Applied Materials:

Recent patent applications by Applied Materials

Applied Materials based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-10-15 ✅ Patent 9,746,678 granted on 2017-08-29
US20150293363A1
Physics

Light wave separation lattices and methods of forming light wave separation lattices

#2 | 2012-03-22 ✅ Patent 8,492,284 granted on 2013-07-23
US20120070961A1
Electricity

Low temperature etchant for treatment of silicon-containing surfaces

#3 | 2010-03-04 ✅ Patent 8,369,978 granted on 2013-02-05
US20100056023A1
Performing operations; transporting

Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

#4 | 2010-01-28 ✅ Patent 8,387,557 granted on 2013-03-05
US20100018460A1
Chemistry; metallurgy

Method for forming silicon-containing materials during a photoexcitation deposition process

#5 | 2007-10-18 ✅ Patent 7,470,599 granted on 2008-12-30
US20070243702A1
Electricity

Dual-side epitaxy processes for production of nitride semiconductor structures

#6 | 2007-06-14 ✅ Patent 7,678,662 granted on 2010-03-16
US20070132054A1
Electricity

Memory cell having stressed layers

#7 | 2007-04-05
US20070077671A1
Electricity

In-situ substrate imaging

#8 | 2006-09-12 ✅ Patent 7,105,460 granted on 2006-09-12
US10193489
-

Nitrogen-free dielectric anti-reflective coating and hardmask

#9 | 2006-09-05 ✅ Patent 7,101,252 granted on 2006-09-05
US10424152
-

Polishing method and apparatus

#10 | 2006-08-08 ✅ Patent 7,086,929 granted on 2006-08-08
US10616488
-

Endpoint detection with multiple light beams

#11 | 2006-07-11 ✅ Patent 7,074,109 granted on 2006-07-11
US10920701
-

Chemical mechanical polishing control system and method

#12 | 2006-07-11 ✅ Patent 7,074,298 granted on 2006-07-11
US10150581
-

High density plasma CVD chamber

#13 | 2006-06-20 ✅ Patent 7,063,597 granted on 2006-06-20
US10693683
-

Polishing processes for shallow trench isolation substrates

#14 | 2006-06-20 ✅ Patent 7,063,455 granted on 2006-06-20
US10338249
-

Chemical dilution system for semiconductor device processing system

#15 | 2006-06-13 ✅ Patent 7,059,948 granted on 2006-06-13
US10026854
-

Articles for polishing semiconductor substrates

#16 | 2006-06-13 ✅ Patent 7,060,234 granted on 2006-06-13
US9908668
-

Process and apparatus for abatement of by products generated from deposition processes and cleaning of deposition chambers

#17 | 2006-06-06 ✅ Patent 7,055,809 granted on 2006-06-06
US10817396
-

Vaporizing reactant liquids for chemical vapor deposition film processing

#18 | 2006-06-06 ✅ Patent 7,055,808 granted on 2006-06-06
US10305827
-

Vaporizing reactant liquids for chemical vapor deposition film processing

#19 | 2006-05-30 ✅ Patent 7,052,552 granted on 2006-05-30
US9920891
-

Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD

#20 | 2006-05-23 ✅ Patent 7,048,607 granted on 2006-05-23
US9583512
-

System and method for chemical mechanical planarization

#21 | 2006-05-09 ✅ Patent 7,042,558 granted on 2006-05-09
US10619171
-

Eddy-optic sensor for object inspection

#22 | 2006-04-11 ✅ Patent 7,025,861 granted on 2006-04-11
US10360234
-

Contact plating apparatus

#23 | 2006-04-11 ✅ Patent 7,025,862 granted on 2006-04-11
US10278527
-

Plating uniformity control by contact ring shaping

#24 | 2006-03-02 ✅ Patent 7,087,536 granted on 2006-08-08
US20060046508A1
Electricity

Silicon oxide gapfill deposition using liquid precursors

#25 | 2006-01-26 ✅ Patent 7,081,042 granted on 2006-07-25
US20060019582A1
Performing operations; transporting

Substrate removal from polishing tool

#26 | 2005-12-15 ✅ Patent 7,096,085 granted on 2006-08-22
US20050278051A1
Physics

Process control by distinguishing a white noise component of a process variance

#27 | 2005-12-15 ✅ Patent 7,033,945 granted on 2006-04-25
US20050277257A1
Electricity

Gap filling with a composite layer

#28 | 2005-12-08 ✅ Patent 7,063,749 granted on 2006-06-20
US20050268937A1
Electricity

Scrubber with sonic nozzle

#29 | 2005-09-29 ✅ Patent 7,060,638 granted on 2006-06-13
US20050215065A1
Electricity

Method of forming low dielectric constant porous films

#30 | 2005-09-22 ✅ Patent 7,040,956 granted on 2006-05-09
US20050208879A1
Performing operations; transporting

Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life

#31 | 2005-09-08 ✅ Patent 7,087,497 granted on 2006-08-08
US20050196929A1
Electricity

Low-thermal-budget gapfill process

#32 | 2005-09-08 ✅ Patent 7,049,612 granted on 2006-05-23
US20050194548A1
Electricity

Electron beam treatment apparatus

#33 | 2005-08-18 ✅ Patent 7,070,475 granted on 2006-07-04
US20050178743A1
Performing operations; transporting

Process control in electrochemically assisted planarization

#34 | 2005-08-11 ✅ Patent 7,044,832 granted on 2006-05-16
US20050176349A1
Performing operations; transporting

Load cup for chemical mechanical polishing

#35 | 2005-08-04 ✅ Patent 7,064,078 granted on 2006-06-20
US20050167394A1
Physics

Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme

#36 | 2005-07-28 ✅ Patent 7,049,211 granted on 2006-05-23
US20050164517A1
Chemistry; metallurgy

In-situ-etch-assisted HDP deposition using SiF

#37 | 2005-07-14 ✅ Patent 7,094,710 granted on 2006-08-22
US20050153574A1
Chemistry; metallurgy

Very low dielectric constant plasma-enhanced CVD films

#38 | 2005-05-12 ✅ Patent 7,205,205 granted on 2007-04-17
US20050101155A1
Electricity

Ramp temperature techniques for improved mean wafer before clean

#39 | 2005-04-14 ✅ Patent 7,064,077 granted on 2006-06-20
US20050079715A1
Electricity

Method for high aspect ratio HDP CVD gapfill

#40 | 2005-02-24 ✅ Patent 7,091,137 granted on 2006-08-15
US20050042889A1
Chemistry; metallurgy

Bi-layer approach for a hermetic low dielectric constant layer for barrier applications

#41 | 2005-02-24 ✅ Patent 7,040,966 granted on 2006-05-09
US20050042877A1
Electricity

Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers

#42 | 2005-02-24 ✅ Patent 7,049,249 granted on 2006-05-23
US20050042858A1
Electricity

Method of improving stability in low k barrier layers

Also check out Applied Materials' (Santa Clara, United States) applicant profile with 2 patent applications submitted.

AssigneeID:

178895 ⎘