Goleta, California
United States
124
2025-08-28
The entities that hold a legal rights for patent applications filed by inventor Wu Yifeng:
Yifeng Wu from Goleta, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED DESIGN FOR III-NITRIDE DEVICES
#2 | 2024-01-11Integrated design for III-Nitride devices
#3 | 2023-12-28WIDE BANDGAP TRANSISTORS WITH GATE-SOURCE FIELD PLATES
#4 | 2023-09-28Module configurations for integrated III-nitride devices
#5 | 2022-04-19Switching circuits having drain connected ferrite beads
#6 | 2021-12-30Integrated design for III-Nitride devices
#7 | 2021-12-16Module configurations for integrated III-Nitride devices
#8 | 2021-01-19Switching circuits having drain connected ferrite beads
#9 | 2020-04-21Switching circuits having drain connected ferrite beads
#10 | 2018-08-28Bridgeless power factor correction circuits
#11 | 2017-12-21Wide bandgap field effect transistors with source connected field plates
#12 | 2017-08-03Switching circuits having ferrite beads
#13 | 2017-03-23Switching circuits having ferrite beads
#14 | 2017-03-07Bridgeless power factor correction circuits
#15 | 2017-01-26Fabrication of single or multiple gate field plates
#16 | 2016-08-18Semiconductor modules and methods of forming the same
#17 | 2016-03-17Semiconductor power modules and devices
#18 | 2016-03-17SEMICONDUCTOR MODULES AND METHODS OF FORMING THE SAME
#19 | 2016-02-11Semiconductor electronic components with integrated current limiters
#20 | 2016-02-04High voltage GaN transistor
#21 | 2016-01-07Switching circuits having ferrite beads
#22 | 2015-09-03Gate drivers for circuits based on semiconductor devices
#23 | 2015-05-21Semiconductor power modules and devices
#24 | 2015-03-12Bridge circuits and their components
#25 | 2015-02-12III-N device structures and methods
#26 | 2014-12-25Method of forming electronic components with increased reliability
#27 | 2014-12-25Package configurations for low EMI circuits
#28 | 2014-12-11Group III nitride based flip-chip integrated circuit and method for fabricating
#29 | 2014-11-06Electronic devices and components for high efficiency power circuits
#30 | 2014-11-06Inductive load power switching circuits
#31 | 2014-10-09Semiconductor electronic components with integrated current limiters
#32 | 2014-10-02Gate drivers for circuits based on semiconductor devices
#33 | 2014-10-02Method of forming electronic components with reactive filters
#34 | 2014-07-17Electrode configurations for semiconductor devices
#35 | 2014-04-17Semiconductor power modules and devices
#36 | 2014-04-10III-N device structures and methods
#37 | 2014-04-03Method of forming electronic components with increased reliability
#38 | 2014-02-27Semiconductor heterostructure diodes
#39 | 2014-02-20Package configurations for low EMI circuits
#40 | 2014-02-13Semiconductor electronic components and circuits
#41 | 2014-01-23DEVICES AND COMPONENTS FOR POWER CONVERSION CIRCUITS
#42 | 2014-01-16Semiconductor electronic components with integrated current limiters
#43 | 2013-12-26Methods of fabricating thick semi-insulating or insulating epitaxial gallium nitride layers
#44 | 2013-12-05Inductive load power switching circuits
#45 | 2013-09-26Bridge circuits and their components
#46 | 2013-09-12Package configurations for low EMI circuits
#47 | 2013-08-29Semiconductor power modules and devices
#48 | 2013-06-13Semiconductor modules and methods of forming the same
#49 | 2013-04-11High power semiconductor electronic components with increased reliability
#50 | 2013-03-21LED with integrated constant current driver
#51 | 2013-03-14III-N device structures having a non-insulating substrate
#52 | 2013-01-10Inductive load power switching circuits
#53 | 2013-01-10Inductive load power switching circuits
#54 | 2012-12-13Group III nitride based flip-chip integrated circuit and method for fabricating
#55 | 2012-10-25Semiconductor heterostructure diodes
#56 | 2012-10-18LED with integrated constant current driver
#57 | 2012-09-20Normally-off semiconductor devices
#58 | 2012-09-20Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions
#59 | 2012-09-13High temperature performance capable gallium nitride transistor
#60 | 2012-09-06High voltage GaN transistor
#61 | 2012-09-06Electrode configurations for semiconductor devices
#62 | 2012-08-30Electronic components with reactive filters
#63 | 2012-08-02III-N device structures and methods
#64 | 2012-05-31Package configurations for low EMI circuits
#65 | 2012-05-31Wide bandgap transistor devices with field plates
#66 | 2012-05-03LED with integrated constant current driver
#67 | 2012-03-01GaN based HEMTs with buried field plates
#68 | 2011-10-27Methods of fabricating normally-off semiconductor devices
#69 | 2011-10-13Bridge circuits and their components
#70 | 2011-09-15Robust transistors with fluorine treatment
#71 | 2011-08-11Semiconductor electronic components and circuits
#72 | 2011-07-14Electronic devices and components for high efficiency power circuits
#73 | 2011-07-14Wide bandgap HEMTS with source connected field plates
#74 | 2011-06-02Semiconductor heterostructure diodes
#75 | 2011-05-19High voltage GaN transistors
#76 | 2011-05-05Package configurations for low EMI circuits
#77 | 2011-03-17Group III nitride based flip-chip integrated circuit and method for fabricating
#78 | 2011-03-10Methods of forming group III-nitride semiconductor devices including implanting ions directly into source and drain regions and annealing to activate the implanted ions
#79 | 2011-01-27Fabrication of single or multiple gate field plates
#80 | 2010-08-12III-nitride devices and circuits
#81 | 2010-07-29Heterojunction transistors having barrier layer bandgaps greater than channel layer bandgaps and related methods
#82 | 2010-06-10Semiconductor heterostructure diodes
#83 | 2010-05-06High voltage GaN transistors
#84 | 2010-03-25Inductive load power switching circuits
#85 | 2010-02-18Robust transistors with fluorine treatment
#86 | 2010-02-04Normally-off semiconductor devices
#87 | 2009-12-24Insulting gate AlGaN/GaN HEMT
#88 | 2009-12-17LED fabrication via ion implant isolation
#89 | 2009-10-29Wide bandgap transistors with multiple field plates
#90 | 2009-09-24Wide bandgap HEMTs with source connected field plates
#91 | 2009-09-10Wide bandgap transistor devices with field plates
#92 | 2009-08-13Bridge circuits and their components
#93 | 2009-04-23Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions
#94 | 2009-03-12III-nitride bidirectional switches
#95 | 2009-01-22LED with integrated constant current driver
#96 | 2008-10-16High efficiency AC LED driver circuit
#97 | 2008-09-25High temperature performance capable gallium nitride transistor
#98 | 2008-06-05GaN based HEMTs with buried field plates
#99 | 2008-05-22High voltage GaN transistors
#100 | 2007-10-11High efficiency and/or high power density wide bandgap transistors
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