Naperville, Illinois
United States
16
2023-10-12
The entities that hold a legal rights for patent applications filed by inventor Linnen Daniel:
Daniel Linnen from Naperville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Clamped semiconductor wafers and semiconductor devices
#2 | 2023-08-03Voltage sharing across memory dies in response to a charge pump failure
#3 | 2023-02-09Data storage device with data verification circuitry
#4 | 2022-10-25Non-volatile storage with processive writes
#5 | 2022-04-14Semiconductor device including coupled bond pads having differing numbers of pad legs
#6 | 2022-04-07System and method for die crack detection in a CMOS bonded array
#7 | 2022-03-24System and method for warpage detection in a CMOS bonded array
#8 | 2022-03-17Straight wirebonding of silicon dies
#9 | 2021-11-18Semiconductor device including vertical bond pads
#10 | 2021-09-09Semiconductor device including fractured semiconductor dies
#11 | 2021-08-26Data storage device adaptor with securement mechanism
#12 | 2021-06-24Data storage device with dynamic stripe length manager
#13 | 2020-04-02Non-volatile storage system with program failure recovery
#14 | 2019-05-02Partial memory die
#15 | 2019-05-02Partial memory die with inter-plane re-mapping
#16 | 2018-12-06High-speed data path testing techniques for non-volatile memory
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