Chikara AIKAWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-16

Top Assignees for applications by Chikara AIKAWA

The entities that hold a legal rights for patent applications filed by inventor AIKAWA Chikara:

TOKYO SEIMITSU CO., LTD. 5 Tokyo, Japan
DISCO CORPORATION 3 Tokyo, Japan

Recent patent applications by AIKAWA Chikara

Chikara AIKAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-16

US20250018504A1

Performing operations; transporting

LASER OPTICAL SYSTEM AND ADJUSTMENT METHOD THEREFOR, AND LASER MACHINING DEVICE AND METHOD

#2 | 2025-01-16

US20250018502A1

Performing operations; transporting

LASER LIGHT CORRECTION METHOD

#3 | 2025-01-16

US20250018501A1

Performing operations; transporting

METHOD AND DEVICE FOR ADJUSTING OPTICAL AXIS OF LASER LIGHT

#4 | 2023-08-24

US20230264292A1

Performing operations; transporting

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

#5 | 2023-05-18

US20230150054A1

Performing operations; transporting

LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CONTROLLING LASER MACHINING DEVICE

#6 | 2015-10-08

US20150283650A1

Performing operations; transporting

Laser processing apparatus

#7 | 2015-07-30

US20150214432A1

Electricity

OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR

#8 | 2015-04-16

US20150104930A1

Electricity

Wafer processing method

#9 | 2013-05-16

US20130122619A1

Electricity

OPTICAL DEVICE WAFER PROCESSING METHOD

InventorID:

248001 ⎘