Pleasanton, California
United States
43
2021-04-15
The entities that hold a legal rights for patent applications filed by inventor Menk Gregory E.:
Gregory E. Menk from Pleasanton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Polishing pads produced by an additive manufacturing process
#2 | 2020-05-14CMP pad construction with composite material properties using additive manufacturing processes
#3 | 2020-04-30Techniques for combining CMP process tracking data with 3D printed CMP consumables
#4 | 2020-04-02Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#5 | 2019-10-03PRINTED CHEMICAL MECHANICAL POLISHING PAD
#6 | 2018-07-26Thin plastic polishing article for CMP applications
#7 | 2018-06-14CMP pad construction with composite material properties using additive manufacturing processes
#8 | 2018-02-15Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#9 | 2017-05-11Techniques for combining CMP process tracking data with 3D printed CMP consumables
#10 | 2016-04-28Polishing pads produced by an additive manufacturing process
#11 | 2016-04-21Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#12 | 2016-04-21Polishing pads produced by an additive manufacturing process
#13 | 2016-04-21CMP pad construction with composite material properties using additive manufacturing processes
#14 | 2016-04-21Printed chemical mechanical polishing pad
#15 | 2016-04-21Polishing pads produced by an additive manufacturing process
#16 | 2016-04-14CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
#17 | 2014-10-30METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
#18 | 2014-08-28FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA
#19 | 2014-08-28METHOD OF FORMING POLISHING SHEET
#20 | 2014-04-24Endpointing with selective spectral monitoring
#21 | 2013-05-16PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE
#22 | 2012-04-26Method for compensation of variability in chemical mechanical polishing consumables
#23 | 2012-02-02Retaining ring with shaped profile
#24 | 2012-01-26REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME
#25 | 2012-01-12CLOSED-LOOP CONTROL OF CMP SLURRY FLOW
#26 | 2011-10-20Closed-loop control for improved polishing pad profiles
#27 | 2010-05-06MONOLITHIC LINEAR POLISHING SHEET
#28 | 2010-02-11Chemical mechanical polisher with heater and method
#29 | 2009-12-24Closed-loop control for effective pad conditioning
#30 | 2009-10-08Polishing article with integrated window stripe
#31 | 2009-04-02LEADER AND TRAILER FOR LINEAR POLISHING SHEET
#32 | 2009-01-22Retaining ring with shaped profile
#33 | 2008-07-31SELECTIVE CHEMISTRY FOR FIXED ABRASIVE CMP
#34 | 2007-09-13Smart polishing media assembly for planarizing substrates
#35 | 2007-08-23Polishing system with spiral-grooved subpad
#36 | 2007-08-23Polishing article with window stripe
#37 | 2007-08-23Polishing apparatus with grooved subpad
#38 | 2007-08-23Polishing article with integrated window stripe
#39 | 2007-08-23Polishing article with integrated window stripe
#40 | 2007-08-23Dechuck using subpad with recess
#41 | 2007-05-24Materials for chemical mechanical polishing
#42 | 2006-11-02Materials for chemical mechanical polishing
#43 | 2006-06-20Polishing processes for shallow trench isolation substrates
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