Veitsbronn
Germany
18
2025-10-02
The entities that hold a legal rights for patent applications filed by inventor Ort Thomas:
Thomas Ort from Veitsbronn, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
#2 | 2024-10-24PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER
#3 | 2024-06-13FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
#4 | 2023-03-23Package formation methods including coupling a molded routing layer to an integrated routing layer
#5 | 2022-10-20Fan out package with integrated peripheral devices and methods
#6 | 2022-02-17FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A SUPPORT
#7 | 2020-09-24Fan out package with integrated peripheral devices and methods
#8 | 2020-08-06Fan out package and methods
#9 | 2020-07-16Semiconductor packages, and methods for forming semiconductor packages
#10 | 2020-04-02Face-up fan-out electronic package with passive components using a support
#11 | 2019-12-26Molded substrate package in fan-out wafer level package
#12 | 2019-10-03Component magnetic shielding for microelectronic devices
#13 | 2019-10-03Fan out package with integrated peripheral devices and methods
#14 | 2019-07-11THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES
#15 | 2019-07-04Molded substrate package in fan-out wafer level package
#16 | 2019-07-04Face-up fan-out electronic package with passive components using a support
#17 | 2019-06-27Package including an integrated routing layer and a molded routing layer
#18 | 2012-03-01Method and system for routing electrical connections of semiconductor chips
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