Milpitas, California
United States
107
2026-02-05
The entities that hold a legal rights for patent applications filed by inventor Wang Liang:
Liang Wang from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRATED PHOTONICS
#2 | 2026-02-05DIRECT-BONDED OPTOELECTRONIC DEVICES
#3 | 2025-11-06SEAL FOR MICROELECTRONIC ASSEMBLY
#4 | 2025-03-27DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS
#5 | 2025-03-06BONDED STRUCTURES
#6 | 2025-01-30DIRECT-BONDED OPTOELECTRONIC DEVICES
#7 | 2024-05-16BONDED STRUCTURES
#8 | 2024-04-11BONDED STRUCTURES
#9 | 2024-02-22Method of direct-bonded optoelectronic devices
#10 | 2023-12-28SEAL FOR MICROELECTRONIC ASSEMBLY
#11 | 2023-11-09Bonded structures
#12 | 2023-10-05Direct-bonded LED arrays drivers
#13 | 2023-08-17CAVITY PACKAGES
#14 | 2023-06-15BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
#15 | 2022-12-29Seal for microelectronic assembly
#16 | 2022-11-17Bonded structures
#17 | 2022-01-20Back Biasing of FD-SOI Circuit Block
#18 | 2021-09-16Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
#19 | 2021-07-01Bonded structures
#20 | 2021-05-06Cavity packages
#21 | 2020-05-07Bonded structures
#22 | 2020-05-07Seal for microelectronic assembly
#23 | 2020-05-07Seal for microelectronic assembly
#24 | 2020-04-23Bonded structures
#25 | 2020-04-23Structures and methods for reliable packages
#26 | 2020-01-30HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIAS
#27 | 2019-08-15Back biasing of FD-SOI circuit blocks
#28 | 2019-06-27Bonded structures
#29 | 2019-06-27Cavity packages
#30 | 2019-05-23Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
#31 | 2019-03-21Direct-bonded LED arrays and applications
#32 | 2018-12-20Multi-chip modules formed using wafer-level processing of a reconstitute wafer
#33 | 2018-11-22Bonded structures
#34 | 2018-09-27Seal for microelectronic assembly
#35 | 2018-08-16Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
#36 | 2018-08-09Bonded structures
#37 | 2018-08-02Embedded graphite heat spreader for 3DIC
#38 | 2018-06-21Bonded structures
#39 | 2018-05-03Contact structures with porous networks for solder connections, and methods of fabricating same
#40 | 2018-04-26Bonding of laminates with electrical interconnects
#41 | 2018-04-05System and method for providing 3D wafer assembly with known-good-dies
#42 | 2018-03-15Making electrical components in handle wafers of integrated circuit packages
#43 | 2017-12-28Interposers with electrically conductive features having different porosities
#44 | 2017-11-09Nanoscale interconnect array for stacked dies
#45 | 2017-10-26Structures and methods for reliable packages
#46 | 2017-09-28Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
#47 | 2017-08-17Multichip modules and methods of fabrication
#48 | 2017-07-13Light emitting diode device with reconstituted LED components on substrate
#49 | 2017-06-29SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES
#50 | 2017-06-22High yield substrate assembly
#51 | 2017-05-25Multi-chip microelectronic assembly with built-up fine-patterned circuit structure
#52 | 2017-05-25Hybrid 3D/2.5D interposer
#53 | 2017-05-04Interconnection substrates for interconnection between circuit modules, and methods of manufacture
#54 | 2017-04-27Anchoring structure of fine pitch bva
#55 | 2017-04-06Interposers
#56 | 2017-04-06HD color imaging using monochromatic CMOS image sensors integrated in 3D package
#57 | 2017-03-23Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#58 | 2017-03-16Making electrical components in handle wafers of integrated circuit packages
#59 | 2017-01-19Flipped die stack
#60 | 2017-01-19Microelectronic assemblies formed using metal silicide, and methods of fabrication
#61 | 2017-01-19Microelectronic assemblies with cavities, and methods of fabrication
#62 | 2017-01-19Flipped die stack assemblies with leadframe interconnects
#63 | 2016-12-29Structures and methods for reliable packages
#64 | 2016-12-15Reversed build-up substrate for 2.5D
#65 | 2016-11-03Making multilayer 3D capacitors using arrays of upstanding rods or ridges
#66 | 2016-10-27Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
#67 | 2016-10-25Microelectronic assemblies with cavities, and methods of fabrication
#68 | 2016-09-08Batch process fabrication of package-on-package microelectronic assemblies
#69 | 2016-09-08Embedded graphite heat spreader for 3DIC
#70 | 2016-09-06Reversed build-up substrate for 2.5D
#71 | 2016-08-25Microelectronic assemblies formed using metal silicide, and methods of fabrication
#72 | 2016-07-28Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
#73 | 2016-07-19Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
#74 | 2016-07-14Inverted optical device
#75 | 2016-06-30Contact structures with porous networks for solder connections, and methods of fabricating same
#76 | 2016-06-09Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#77 | 2016-06-02Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
#78 | 2016-05-05Multi-layer substrates suitable for interconnection between circuit modules
#79 | 2016-03-17Batch process fabrication of package-on-package microelectronic assemblies
#80 | 2016-03-17Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias
#81 | 2016-03-10Multichip modules and methods of fabrication
#82 | 2016-02-18Making electrical components in handle wafers of integrated circuit packages
#83 | 2015-12-24BACK-END-OF-LINE STACK FOR A STACKED DEVICE
#84 | 2015-12-17Making multilayer 3D capacitors using arrays of upstanding rods or ridges
#85 | 2015-11-05Making electrical components in handle wafers of integrated circuit packages
#86 | 2015-10-15HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIAS
#87 | 2015-10-15Light emitting diode device with reconstituted LED components on substrate
#88 | 2015-10-01Batch process fabrication of package-on-package microelectronic assemblies
#89 | 2015-09-17OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES
#90 | 2015-09-17Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
#91 | 2015-08-13FRONT FACING PIGGYBACK WAFER ASSEMBLY
#92 | 2015-06-18Quantum efficiency of multiple quantum wells
#93 | 2015-06-18HIGH YIELD SUBSTRATE ASSEMBLY
#94 | 2015-05-14Non-crystalline inorganic light emitting diode
#95 | 2015-02-12Micro mechanical anchor for 3D architecture
#96 | 2014-06-26Non-crystalline inorganic light emitting diode
#97 | 2014-02-13Parallel plate slot emission array
#98 | 2014-02-13INTERNAL OPTICAL EXTRACTION LAYER FOR OLED DEVICES
#99 | 2014-01-16High performance light emitting diode with vias
#100 | 2014-01-09OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICES
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