Spicewood, Texas
United States
36
2025-10-02
The entities that hold a legal rights for patent applications filed by inventor Black Bryan:
Bryan Black from Spicewood, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Through Package Vertical Interconnect and Method of Making Same
#2 | 2025-09-18Through Package Vertical Interconnect and Method of Making Same
#3 | 2024-10-10Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive Substrate
#4 | 2023-12-21Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate
#5 | 2023-12-07Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same
#6 | 2023-10-26Through Package Vertical Interconnect and Method of Making Same
#7 | 2023-02-02Semiconductor chip with redundant thru-silicon-vias
#8 | 2017-07-27Interposer with beyond reticle field conductor pads
#9 | 2017-03-30Semiconductor workpiece with selective backside metallization
#10 | 2016-12-15Semiconductor chip with redundant thru-silicon-vias
#11 | 2014-04-17Semiconductor chip device with polymeric filler trench
#12 | 2013-12-26SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
#13 | 2013-12-26Interposer with identification system
#14 | 2013-10-03DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
#15 | 2013-10-03STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#16 | 2013-10-03Thermal management of stacked semiconductor chips with electrically non-functional interconnects
#17 | 2013-06-27SEMICONDUCTOR CHIP WITH OFFSET PADS
#18 | 2013-06-20Unified data masking, data poisoning, and data bus inversion signaling
#19 | 2013-06-20Interconnect Redundancy for Multi-Interconnect Device
#20 | 2013-06-20Data bus inversion coding
#21 | 2013-06-13HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
#22 | 2013-06-06METHOD AND APPARATUS FOR MULTI-CHIP PROCESSING
#23 | 2012-08-16Semiconductor chip with reinforcing through-silicon-vias
#24 | 2012-04-26Semiconductor chip device with liquid thermal interface material
#25 | 2012-03-29Stacked semiconductor chip device with thermal management
#26 | 2012-03-29Semiconductor chip with reinforcing through-silicon-vias
#27 | 2012-03-15Semiconductor chip device with underfill
#28 | 2012-03-15Semiconductor chip device with polymeric filler trench
#29 | 2012-03-15Semiconductor chip with redundant thru-silicon-vias
#30 | 2012-02-23Stacked semiconductor chip device with thermal management circuit board
#31 | 2012-02-23Stacked semiconductor chips with thermal management
#32 | 2012-02-23Semiconductor chip with thermal interface tape
#33 | 2012-02-16Method of manufacturing and assembling semiconductor chips with offset pads
#34 | 2011-12-15Thermal interface material with support structure
#35 | 2011-03-10Die stacking, testing and packaging for yield
#36 | 2010-09-23Thermal interface material with support structure
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