Inventor profile of:

Gamal Refai-Ahmed

City:

Markham

Country:

Canada

Published Applications:

37

Last publication date:

2023-02-02

Top Assignees for applications by Gamal Refai-Ahmed

The entities that hold a legal rights for patent applications filed by inventor Refai-Ahmed Gamal:

Recent patent applications by Refai-Ahmed Gamal

Gamal Refai-Ahmed from Markham, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-02-02
US20230031099A1
Electricity

Semiconductor chip with redundant thru-silicon-vias

#2 | 2014-04-17
US20140103506A1
Electricity

Semiconductor chip device with polymeric filler trench

#3 | 2013-06-27
US20130161814A1
Electricity

SEMICONDUCTOR CHIP WITH OFFSET PADS

#4 | 2013-06-13
US20130147028A1
Electricity

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

#5 | 2013-06-06
US20130141866A1
Electricity

Portable computing device with thermal management

#6 | 2012-11-01
US20120278029A1
Physics

Transient thermal modeling of multisource power devices

#7 | 2012-08-16
US20120205791A1
Electricity

Semiconductor chip with reinforcing through-silicon-vias

#8 | 2012-04-26
US20120098119A1
Electricity

Semiconductor chip device with liquid thermal interface material

#9 | 2012-03-29
US20120075807A1
Electricity

Stacked semiconductor chip device with thermal management

#10 | 2012-03-29
US20120074579A1
Electricity

Semiconductor chip with reinforcing through-silicon-vias

#11 | 2012-03-15
US20120061853A1
Electricity

Semiconductor chip device with underfill

#12 | 2012-03-15
US20120061852A1
Electricity

Semiconductor chip device with polymeric filler trench

#13 | 2012-03-15
US20120061821A1
Electricity

Semiconductor chip with redundant thru-silicon-vias

#14 | 2012-02-23
US20120043669A1
Electricity

Stacked semiconductor chip device with thermal management circuit board

#15 | 2012-02-23
US20120043668A1
Electricity

Stacked semiconductor chips with thermal management

#16 | 2012-02-23
US20120043539A1
Electricity

Semiconductor chip with thermal interface tape

#17 | 2011-12-15
US20110304051A1
Electricity

Thermal interface material with support structure

#18 | 2011-10-06
US20110245981A1
Physics

Computing center power and cooling control apparatus and method

#19 | 2010-12-30
US20100328887A1
Electricity

Heat sink for a circuit device

#20 | 2010-12-30
US20100327431A1
Electricity

Semiconductor chip thermal interface structures

#21 | 2010-12-16
US20100314093A1
Physics

VARIABLE HEAT EXCHANGER

#22 | 2010-09-23
US20100237496A1
Electricity

Thermal interface material with support structure

#23 | 2010-09-16
US20100230805A1
Electricity

Multi-die semiconductor package with heat spreader

#24 | 2010-04-29
US20100103619A1
Electricity

Interchangeable Heat Exchanger for a Circuit Board

#25 | 2010-02-04
US20100030500A1
Physics

Regulation of Power Consumption for Application-Specific Integrated Circuits

#26 | 2010-01-21
US20100014251A1
Electricity

Multidimensional Thermal Management Device for an Integrated Circuit Chip

#27 | 2009-06-04
US20090140417A1
Electricity

Holistic thermal management system for a semiconductor chip

#28 | 2008-10-16
US20080253087A1
Mechanical engineering

THERMAL MANAGEMENT SYSTEM FOR AN ELECTRONIC DEVICE

#29 | 2008-08-14
US20080192441A1
Electricity

Thermal management device for multiple heat producing devices

#30 | 2008-02-21
US20080043438A1
Electricity

Cross-flow thermal management device and method of manufacture thereof

#31 | 2008-02-21
US20080043437A1
Electricity

Three-dimensional thermal spreading in an air-cooled thermal device

#32 | 2007-07-05
US20070153483A1
Electricity

Thermal management device for multiple heat producing devices

#33 | 2007-05-17
US20070108595A1
Electricity

Semiconductor device with integrated heat spreader

#34 | 2007-03-01
US20070047211A1
Electricity

Variable spring rate thermal management apparatus attachment mechanism

#35 | 2007-03-01
US20070044483A1
Mechanical engineering

Localized refrigerator apparatus for a thermal management device

#36 | 2006-09-07
US20060198108A1
Electricity

Thermal management apparatus and method for a circuit substrate

#37 | 2006-06-01
US20060114657A1
Physics

Thermal management apparatus

InventorID:

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