Inventor profile of:

Bin Yang

City:

Ossining, New York

Country:

United States

Published Applications:

17

Last publication date:

2013-10-10

Top Assignees for applications by Bin Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Bin:

Recent patent applications by Yang Bin

Bin Yang from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-10
US20130267090A1
Electricity

Method to control metal semiconductor micro-structure

#2 | 2013-09-19
US20130241008A1
Electricity

Use of band edge gate metals as source drain contacts

#3 | 2013-09-19
US20130241007A1
Electricity

USE OF BAND EDGE GATE METALS AS SOURCE DRAIN CONTACTS

#4 | 2013-01-10
US20130012020A1
Electricity

Method of fabricating an epitaxial Ni silicide film

#5 | 2012-11-29
US20120298965A1
Electricity

Multigate structure formed with electroless metal deposition

#6 | 2012-11-22
US20120295439A1
Electricity

Metal-Semiconductor Intermixed Regions

#7 | 2012-07-26
US20120190192A1
Electricity

Metal-semiconductor intermixed regions

#8 | 2012-07-19
US20120181697A1
Electricity

Method to control metal semiconductor micro-structure

#9 | 2012-05-31
US20120132989A1
Electricity

Multigate structure formed with electroless metal deposition

#10 | 2012-05-10
US20120112292A1
Electricity

INTERMIXED SILICIDE FOR REDUCTION OF EXTERNAL RESISTANCE IN INTEGRATED CIRCUIT DEVICES

#11 | 2012-04-26
US20120098042A1
Electricity

Semiconductor device with reduced junction leakage and an associated method of forming such a semiconductor device

#12 | 2011-10-27
US20110260252A1
Electricity

Use of epitaxial Ni silicide

#13 | 2011-10-06
US20110241213A1
Electricity

Silicide contact formation

#14 | 2011-10-04
US12849223
-

Method for forming a protection layer over metal semiconductor contact and structure formed thereon

#15 | 2011-09-22
US20110230017A1
Electricity

Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide

#16 | 2011-09-22
US20110227156A1
Electricity

SOI schottky source/drain device structure to control encroachment and delamination of silicide

#17 | 2011-06-23
US20110147809A1
Electricity

FORMING A CARBON CONTAINING LAYER TO FACILITATE SILICIDE STABILITY IN A SILICON GERMANIUM MATERIAL

InventorID:

28759 ⎘