Taichung
Taiwan
21
2025-02-06
The entities that hold a legal rights for patent applications filed by inventor Chung Chee-Key:
Chee-Key Chung from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR FABRICATING ELECTRONIC PACKAGE
#2 | 2024-05-16Electronic package and fabrication method thereof
#3 | 2023-08-24Method for fabricating electronic package
#4 | 2022-10-20Electronic package and fabrication method thereof
#5 | 2022-04-28Electronic package and manufacturing method thereof
#6 | 2021-10-14Electronic package, manufacturing method thereof and conductive structure
#7 | 2021-09-23Method for fabricating electronic package
#8 | 2021-09-16Electronic package and fabrication method thereof
#9 | 2021-09-09ELECTRONIC PACKAGE
#10 | 2021-03-18Electronic package and fabrication method thereof
#11 | 2021-03-04Method for fabricating carrier structure
#12 | 2020-12-24Electronic package and method for fabricating the same
#13 | 2020-12-08Electronic package carrier structure thereof, and method for fabricating the carrier structure
#14 | 2020-10-22Method for fabricating electronic package
#15 | 2020-05-28Electronic package, method for fabricating the same, and heat dissipator
#16 | 2020-03-19Method for manufacturing electronic package
#17 | 2019-08-15Method for manufacturing electronic package
#18 | 2019-08-01Electronic package
#19 | 2019-06-13Electronic package and method for fabricating the same
#20 | 2019-05-30Electronic package and method for fabricating the same
#21 | 2018-09-20Substrate construction and electronic package including the same
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