Inventor profile of:

Doyle E. Bennett

City:

Santa Clara, California

Country:

United States

Published Applications:

41

Last publication date:

2026-01-15

Top Assignees for applications by Doyle E. Bennett

The entities that hold a legal rights for patent applications filed by inventor Bennett Doyle E.:

Recent patent applications by Bennett Doyle E.

Doyle E. Bennett from Santa Clara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-15
US20260014663A1
Performing operations; transporting

COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING

#2 | 2024-01-11
US20240014080A1
Electricity

Technique for training neural network for use in in-situ monitoring during polishing and polishing system

#3 | 2023-09-14
US20230290691A1
Electricity

Trained neural network in in-situ monitoring during polishing and polishing system

#4 | 2021-12-09
US20210379723A1
Performing operations; transporting

COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING

#5 | 2021-11-18
US20210358819A1
Electricity

Using a trained neural network for use in in-situ monitoring during polishing and polishing system

#6 | 2021-11-18
US20210354265A1
Performing operations; transporting

Technique for training neural network for use in in-situ monitoring during polishing and polishing system

#7 | 2019-05-09
US20190134775A1
Performing operations; transporting

Determination of gain for eddy current sensor

#8 | 2016-06-09
US20160158908A1
Performing operations; transporting

Determination of gain for eddy current sensor

#9 | 2016-04-14
US20160101497A1
Performing operations; transporting

Multi-Platen Multi-Head Polishing Architecture

#10 | 2015-08-13
US20150224623A1
Performing operations; transporting

Adjusting eddy current measurements

#11 | 2015-04-30
US20150118766A1
Electricity

Determination of gain for eddy current sensor

#12 | 2015-04-30
US20150118765A1
Electricity

Determination of gain for eddy current sensor

#13 | 2014-08-28
US20140242883A1
Performing operations; transporting

DETERMINATION OF WAFER ANGULAR POSITION FOR IN-SEQUENCE METROLOGY

#14 | 2014-08-28
US20140242881A1
Performing operations; transporting

FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA

#15 | 2014-08-28
US20140242879A1
Performing operations; transporting

Path for probe of spectrographic metrology system

#16 | 2014-05-22
US20140141696A1
Performing operations; transporting

Polishing System with In-Sequence Sensor

#17 | 2014-05-22
US20140141695A1
Performing operations; transporting

Multi-platen multi-head polishing architecture

#18 | 2014-05-08
US20140127971A1
Performing operations; transporting

In-situ monitoring system with monitoring of elongated region

#19 | 2014-04-24
US20140113524A1
Performing operations; transporting

Endpointing with selective spectral monitoring

#20 | 2013-06-20
US20130157549A1
Performing operations; transporting

Retaining ring and articles for carrier head

#21 | 2012-10-16
US12625412
-

Reducing polishing pad deformation

#22 | 2012-10-11
US20120258649A1
Performing operations; transporting

Method of making and apparatus having windowless polishing pad and protected fiber

#23 | 2012-09-13
US20120227903A1
Performing operations; transporting

Automatic Gain Control

#24 | 2011-10-20
US20110256818A1
Performing operations; transporting

Molding windows in thin pads

#25 | 2010-11-04
US20100279585A1
Performing operations; transporting

Method of making and apparatus having windowless polishing pad and protected fiber

#26 | 2010-06-10
US20100144255A1
Performing operations; transporting

Retaining ring and articles for carrier head

#27 | 2010-04-22
US20100099334A1
Performing operations; transporting

Eddy current gain compensation

#28 | 2009-11-24
US11683392
-

Reducing polishing pad deformation

#29 | 2009-06-18
US20090156098A1
Performing operations; transporting

Automatic gain control

#30 | 2008-04-08
US11124420
-

Reducing polishing pad deformation

#31 | 2008-02-14
US20080039000A1
Performing operations; transporting

REATAINING RING AND ARTICLES FOR CARRIER HEAD

#32 | 2008-01-24
US20080020690A1
Performing operations; transporting

REDUCING POLISHING PAD DEFORMATION

#33 | 2007-11-01
US20070251922A1
Performing operations; transporting

Automatic gain control

#34 | 2007-08-14
US9975196
-

Carrier head vibration damping

#35 | 2007-07-24
US11397075
-

Feedback controlled polishing processes

#36 | 2007-05-31
US20070123046A1
Performing operations; transporting

Continuous in-line monitoring and qualification of polishing rates

#37 | 2006-07-11
US10920701
-

Chemical mechanical polishing control system and method

#38 | 2006-04-04
US10396299
-

Feedback controlled polishing processes

#39 | 2006-01-31
US10920726
-

Chemical mechanical polishing with multi-stage monitoring of metal clearing

#40 | 2006-01-12
US20060009132A1
Performing operations; transporting

Chemical mechanical polishing apparatus with non-conductive elements

#41 | 2005-09-20
US10643773
-

Chemical mechanical polishing apparatus with non-conductive elements

InventorID:

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