Inventor profile of:

Theodorus E. Standaert

City:

Pine Bush, New York

Country:

United States

Published Applications:

20

Last publication date:

2013-06-27

Top Assignees for applications by Theodorus E. Standaert

The entities that hold a legal rights for patent applications filed by inventor Standaert Theodorus E.:

Recent patent applications by Standaert Theodorus E.

Theodorus E. Standaert from Pine Bush, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-06-27
US20130164890A1
Electricity

Method for fabricating finFET with merged fins and vertical silicide

#2 | 2013-06-27
US20130161744A1
Electricity

finFET with merged fins and vertical silicide

#3 | 2011-12-27
US12948246
-

Method of forming replacement metal gate with borderless contact and structure thereof

#4 | 2009-12-03
US20090294973A1
Electricity

Interconnect structure for integrated circuits having improved electromigration characteristics

#5 | 2009-12-03
US20090294901A1
Electricity

Structure and method of forming electrically blown metal fuses for integrated circuits

#6 | 2009-06-11
US20090146143A1
Electricity

Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing

#7 | 2009-01-29
US20090031260A1
Physics

Method, Computer Program and System Providing for Semiconductor Processes Optimization

#8 | 2009-01-15
US20090017630A1
Electricity

Methods for forming contacts for dual stress liner CMOS semiconductor devices

#9 | 2008-12-25
US20080318415A1
Electricity

Interconnect structures with encasing cap and methods of making thereof

#10 | 2008-09-11
US20080217777A1
Electricity

Method of forming an embedded barrier layer for protection from chemical mechanical polishing process

#11 | 2008-08-21
US20080197495A1
Electricity

STRUCTURE FOR REDUCING LATERAL FRINGE CAPACITANCE IN SEMICONDUCTOR DEVICES

#12 | 2008-04-17
US20080088027A1
Electricity

Dry etchback of interconnect contacts

#13 | 2007-11-29
US20070275552A1
Electricity

Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices

#14 | 2007-03-15
US20070057374A1
Electricity

Embedded barrier for dielectric encapsulation

#15 | 2007-03-08
US20070054489A1
Electricity

Interconnect structures with encasing cap and methods of making thereof

#16 | 2007-02-08
US20070032055A1
Electricity

Dry etchback of interconnect contacts

#17 | 2006-07-20
US20060160349A1
Electricity

Interconnect structures with encasing cap and methods of making thereof

#18 | 2006-07-04
US10908623
-

Forming of local and global wiring for semiconductor product

#19 | 2006-02-02
US20060024961A1
Electricity

Interlevel dielectric layer and metal layer sealing

#20 | 2005-08-11
US20050176237A1
Electricity

In-situ liner formation during reactive ion etch

InventorID:

307597 ⎘