Junichi Ito

City:

Ibaraki

Country:

Japan

Published Applications:

Last publication date:

2012-05-03

Top Assignees for applications by Junichi Ito

The entities that hold a legal rights for patent applications filed by inventor Ito Junichi:

JX NIPPON MINING & METALS CORPORATION 4 Tokyo, Japan
Nippon Mining & Metals Co., Ltd. 3 Tokyo, Japan
JX NIPPON MINING & METALS CORPORATION 2 Tokyo, Japan
Nippon Mining & Metals Co., Ltd 1 Minato-Ku, Tokyo, Japan
Nagoya University 1 Aichi, Japan
OSAKA UNIVERSITY 1 Osaka, Japan
NIPPON MINING & METALS CO., LTD. 1 Tokyo, Japan

Recent patent applications by Ito Junichi

Junichi Ito from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-05-03

US20120104502A1

Electricity

METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#2 | 2011-10-06

US20110241209A1

Electricity

Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power

#3 | 2011-06-30

US20110155570A1

Chemistry; metallurgy

Barrier film for semiconductor wiring, sintered compact sputtering target and method of producing the sputtering target

#4 | 2011-06-02

US20110129688A1

Chemistry; metallurgy

Plated product having copper thin film formed thereon by electroless plating

#5 | 2010-09-30

US20100244259A1

Electricity

Substrate and manufacturing method therefor

#6 | 2010-09-30

US20100244258A1

Electricity

Substrate and manufacturing method therefor

#7 | 2010-08-26

US20100215970A1

Performing operations; transporting

Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate

#8 | 2010-02-18

US20100038111A1

Electricity

Plated article having metal thin film formed by electroless plating, and manufacturing method thereof

#9 | 2010-01-07

US20100003539A1

Electricity

Plated article having metal thin film formed by electroless plating

InventorID:

3154969 ⎘