Nattheim
Germany
14
2022-03-03
The entities that hold a legal rights for patent applications filed by inventor Hetzel Wolfgang:
Wolfgang Hetzel from Nattheim, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Lead frame-based semiconductor package
#2 | 2011-07-07INTEGRATED DEVICE
#3 | 2010-02-11Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same
#4 | 2008-08-28INTEGRATED CIRCUIT
#5 | 2008-03-13INTEGRATED DEVICE
#6 | 2007-07-12Multi-chip ball grid array package and method of manufacture
#7 | 2007-04-26Integrated chip device in a package
#8 | 2007-04-03Method for manufacturing a stack arrangement of a memory module
#9 | 2007-02-22Semiconductor component comprising an interposer substrate
#10 | 2007-02-15Stackable single package and stacked multi-chip assembly
#11 | 2006-12-28Multi-chip device and method for producing a multi-chip device
#12 | 2005-12-20Electronic component having stacked semiconductor chips in parallel, and a method for producing the component
#13 | 2005-08-09Stack arrangement of a memory module
#14 | 2005-05-17Electronic device having a stack of semiconductor chips and method for the production thereof
3544040 ⎘