Stephan Wege

METHODS FOR FORMING HIGH ASPECT RATIO FEATURES ON A SUBSTRATE

Method for Manufacturing Contact Openings, Method for Manufacturing an Integrated Circuit, an Integrated Circuit

Methods of Manufacturing a Semiconductor Device

Methods of Double Patterning, Photo Sensitive Layer Stack for Double Patterning and System for Double Patterning

Method of Fabricating an Integrated Circuit

Method for Processing a Spacer Structure, Method of Manufacturing an Integrated Circuit, Semiconductor Device and Intermediate Structure with at Least One Spacer Structure

Method of Fabricating an Integrated Circuit

Method for Manufacturing a Structure, Semiconductor Device and Structure on a Substrate

Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls

Method for forming a structure on a substrate and device

Method of preparing a coating solution and a corresponding use of the coating solution for coating a substrate

Method and device for depositing a protective layer during an etching procedure

Method for the treatment of material, in particular in the fabrication of semiconductor components

Apparatus for processing a substrate

Method and device for monitoring the etching operation for a regular depth structure in a semiconductor substrate

Method for production of a semiconductor structure

Photolithographic method for forming a structure in a semiconductor substrate

Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition process

Method for etching high-aspect-ratio features