Gresham, Oregon
United States
6
2010-08-12
The entities that hold a legal rights for patent applications filed by inventor Cui Hao:
Hao Cui from Gresham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
#2 | 2007-10-02Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
#3 | 2007-08-16Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
#4 | 2007-07-19Planarization with reduced dishing
#5 | 2006-06-08Planarization with reduced dishing
#6 | 2006-04-18Planarization with reduced dishing
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