Austin, Texas
United States
43
2009-12-17
The entities that hold a legal rights for patent applications filed by inventor Goodwin Paul:
Paul Goodwin from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Circuit Module Turbulence Enhancement
#2 | 2009-02-26Circuit module with thermal casing systems
#3 | 2009-02-19Heat sink for a high capacity thin module system
#4 | 2008-11-27Buffered memory device
#5 | 2008-11-13Die module system
#6 | 2008-11-13Memory module system and method
#7 | 2008-04-24High capacity thin module system
#8 | 2008-04-24Stackable micropackages and stacked modules
#9 | 2008-04-03Inverted CSP Stacking System and Method
#10 | 2008-02-07High capacity thin module system and method
#11 | 2008-02-07High capacity thin module system and method
#12 | 2007-11-15Perimeter stacking system and method
#13 | 2007-08-30Active cooling methods and apparatus for modules
#14 | 2007-06-07Memory Module System and Method
#15 | 2007-06-07Memory Module System and Method
#16 | 2007-05-24Thin module system and method
#17 | 2007-05-17Buffered Thin Module System and Method
#18 | 2007-03-29Applied heat spreader with cooling fin
#19 | 2006-11-23Memory module system and method
#20 | 2006-11-09System component interposer
#21 | 2006-11-02Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
#22 | 2006-09-14Memory module system and method
#23 | 2006-09-07Modified core for circuit module system and method
#24 | 2006-08-10Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit
#25 | 2006-07-20Inverted CSP stacking system and method
#26 | 2006-07-06Microprocessor optimized for algorithmic processing
#27 | 2006-06-15Circuit module turbulence enhancement systems and methods
#28 | 2006-06-15Flex circuit constructions for high capacity circuit module systems and methods
#29 | 2006-05-04High capacity thin module system
#30 | 2006-04-27Circuit module with thermal casing systems
#31 | 2006-04-06Circuit Module Access System and Method
#32 | 2006-03-09Thin module system and method
#33 | 2006-03-09Compact module system and method
#34 | 2006-03-09Die module system
#35 | 2006-03-09Buffered thin module system and method
#36 | 2006-03-09Thin module system and method
#37 | 2006-03-09Thin module system and method
#38 | 2006-03-09Optimized mounting area circuit module system and method
#39 | 2006-03-09High capacity thin module system and method
#40 | 2006-03-09Thin module system and method with skew reduction
#41 | 2006-03-09Module thermal management system and method
#42 | 2006-03-09Thin module system and method
#43 | 2006-03-09Minimized profile circuit module systems and methods
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