Austin, Texas
United States
42
2009-03-19
33
2009-03-24
These are the the leading inventors for applications assigned to STAKTEK GROUP L.P.:
STAKTEK GROUP L.P. based in Austin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
THIN CIRCUIT MODULE AND METHOD
#2 | 2008-11-27 ✅ Patent 7,508,723 granted on 2009-03-24Buffered memory device
#3 | 2008-10-09Package-Borne Selective Enablement Stacking
#4 | 2008-09-11Managed Memory System
#5 | 2008-05-13 ✅ Patent 7,371,609 granted on 2008-05-13Stacked module systems and methods
#6 | 2008-04-24 ✅ Patent 7,759,791 granted on 2010-07-20High density IC module
#7 | 2008-04-24 ✅ Patent 7,468,553 granted on 2008-12-23Stackable micropackages and stacked modules
#8 | 2008-04-03Inverted CSP Stacking System and Method
#9 | 2008-02-07 ✅ Patent 7,522,425 granted on 2009-04-21High capacity thin module system and method
#10 | 2008-02-07 ✅ Patent 7,606,042 granted on 2009-10-20High capacity thin module system and method
#11 | 2007-11-08Leaded Package Integrated Circuit Stacking
#12 | 2007-07-12 ✅ Patent 7,304,382 granted on 2007-12-04Managed memory component
#13 | 2007-07-12 ✅ Patent 7,605,454 granted on 2009-10-20Memory card and method for devising
#14 | 2007-06-07Memory Module System and Method
#15 | 2007-06-07Memory Module System and Method
#16 | 2007-05-24 ✅ Patent 7,602,613 granted on 2009-10-13Thin module system and method
#17 | 2007-04-12 ✅ Patent 7,259,452 granted on 2007-08-21Leaded package integrated circuit stacking
#18 | 2006-11-23 ✅ Patent 7,323,364 granted on 2008-01-29Stacked module systems and method
#19 | 2006-08-22 ✅ Patent 7,094,632 granted on 2006-08-22Low profile chip scale stacking system and method
#20 | 2006-07-25 ✅ Patent 7,081,373 granted on 2006-07-25CSP chip stack with flex circuit
#21 | 2006-07-20 ✅ Patent 7,309,914 granted on 2007-12-18Inverted CSP stacking system and method
#22 | 2006-06-27 ✅ Patent 7,066,741 granted on 2006-06-27Flexible circuit connector for stacked chip module
#23 | 2006-05-25 ✅ Patent 7,310,458 granted on 2007-12-18Stacked module systems and methods
#24 | 2006-04-25 ✅ Patent 7,033,861 granted on 2006-04-25Stacked module systems and method
#25 | 2006-04-11 ✅ Patent 7,026,708 granted on 2006-04-11Low profile chip scale stacking system and method
#26 | 2006-04-06Circuit Module Access System and Method
#27 | 2006-03-09 ✅ Patent 7,324,352 granted on 2008-01-29High capacity thin module system and method
#28 | 2006-03-02Stacked integrated circuit cascade signaling system and method
#29 | 2005-10-18 ✅ Patent 6,956,284 granted on 2005-10-18Integrated circuit stacking system and method
#30 | 2005-10-18 ✅ Patent 6,955,945 granted on 2005-10-18Memory expansion and chip scale stacking system and method
#31 | 2005-09-15 ✅ Patent 6,992,501 granted on 2006-01-31Reflection-control system and method
#32 | 2005-09-06 ✅ Patent 6,940,729 granted on 2005-09-06Integrated circuit stacking system and method
#33 | 2005-07-19 ✅ Patent 6,919,626 granted on 2005-07-19High density integrated circuit module
#34 | 2005-07-07 ✅ Patent 7,202,555 granted on 2007-04-10Pitch change and chip scale stacking system and method
#35 | 2005-07-05 ✅ Patent 6,914,324 granted on 2005-07-05Memory expansion and chip scale stacking system and method
#36 | 2005-06-21 ✅ Patent 6,908,792 granted on 2005-06-21Chip stack with differing chip package types
#37 | 2005-05-17 ✅ Patent 6,893,899 granted on 2005-05-17Contact member stacking system and method
#38 | 2005-04-12 ✅ Patent 6,878,571 granted on 2005-04-12Panel stacking of BGA devices to form three-dimensional modules
#39 | 2005-03-24 ✅ Patent 7,256,484 granted on 2007-08-14Memory expansion and chip scale stacking system and method
#40 | 2005-02-24 ✅ Patent 7,335,975 granted on 2008-02-26Integrated circuit stacking system and method
#41 | 2005-02-15 ✅ Patent 6,856,010 granted on 2005-02-15Thin scale outline package
#42 | 2005-01-27 ✅ Patent 7,053,478 granted on 2006-05-30Pitch change and chip scale stacking system
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