Austin, Texas
United States
46
2009-05-14
46
2009-12-01
These are the the leading inventors for applications assigned to Entorian Technologies, LP:
Entorian Technologies, LP based in Austin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Low profile stacking system and method
#2 | 2009-03-19 ✅ Patent 7,675,155 granted on 2010-03-09Carrier structure stacking system and method
#3 | 2009-02-26 ✅ Patent 7,737,549 granted on 2010-06-15Circuit module with thermal casing systems
#4 | 2009-02-19 ✅ Patent 7,626,259 granted on 2009-12-01Heat sink for a high capacity thin module system
#5 | 2009-02-03 ✅ Patent 7,485,951 granted on 2009-02-03Modularized die stacking system and method
#6 | 2008-12-18 ✅ Patent 7,804,985 granted on 2010-09-28Circuit module having force resistant construction
#7 | 2008-11-27 ✅ Patent 7,508,723 granted on 2009-03-24Buffered memory device
#8 | 2008-11-13 ✅ Patent 7,768,796 granted on 2010-08-03Die module system
#9 | 2008-05-29 ✅ Patent 7,417,310 granted on 2008-08-26Circuit module having force resistant construction
#10 | 2008-04-24 ✅ Patent 7,459,784 granted on 2008-12-02High capacity thin module system
#11 | 2008-04-24 ✅ Patent 7,759,791 granted on 2010-07-20High density IC module
#12 | 2008-04-24 ✅ Patent 7,468,553 granted on 2008-12-23Stackable micropackages and stacked modules
#13 | 2008-04-17 ✅ Patent 7,719,098 granted on 2010-05-18Stacked modules and method
#14 | 2008-02-14 ✅ Patent 7,572,671 granted on 2009-08-11Stacked module systems and methods
#15 | 2008-02-07 ✅ Patent 7,522,425 granted on 2009-04-21High capacity thin module system and method
#16 | 2008-02-07 ✅ Patent 7,606,042 granted on 2009-10-20High capacity thin module system and method
#17 | 2007-12-20 ✅ Patent 7,573,129 granted on 2009-08-11Contrast interposer stacking system and method
#18 | 2007-12-20 ✅ Patent 7,375,418 granted on 2008-05-20Interposer stacking system and method
#19 | 2007-12-20 ✅ Patent 7,446,403 granted on 2008-11-04Carrier structure stacking system and method
#20 | 2007-11-08 ✅ Patent 7,522,421 granted on 2009-04-21Split core circuit module
#21 | 2007-08-02 ✅ Patent 7,511,969 granted on 2009-03-31Composite core circuit module system and method
#22 | 2007-07-26 ✅ Patent 7,508,058 granted on 2009-03-24Stacked integrated circuit module
#23 | 2007-07-12 ✅ Patent 7,508,069 granted on 2009-03-24Managed memory component
#24 | 2007-07-12 ✅ Patent 7,608,920 granted on 2009-10-27Memory card and method for devising
#25 | 2007-07-12 ✅ Patent 7,605,454 granted on 2009-10-20Memory card and method for devising
#26 | 2007-05-24 ✅ Patent 7,602,613 granted on 2009-10-13Thin module system and method
#27 | 2007-05-10 ✅ Patent 7,576,995 granted on 2009-08-18Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
#28 | 2006-09-14 ✅ Patent 7,606,040 granted on 2009-10-20Memory module system and method
#29 | 2006-09-07 ✅ Patent 7,760,513 granted on 2010-07-20Modified core for circuit module system and method
#30 | 2006-06-15 ✅ Patent 7,579,687 granted on 2009-08-25Circuit module turbulence enhancement systems and methods
#31 | 2006-06-15 ✅ Patent 7,616,452 granted on 2009-11-10Flex circuit constructions for high capacity circuit module systems and methods
#32 | 2006-05-04 ✅ Patent 7,656,678 granted on 2010-02-02Stacked module systems
#33 | 2006-05-04 ✅ Patent 7,443,023 granted on 2008-10-28High capacity thin module system
#34 | 2006-04-27 ✅ Patent 7,446,410 granted on 2008-11-04Circuit module with thermal casing systems
#35 | 2006-03-09 ✅ Patent 7,606,050 granted on 2009-10-20Compact module system and method
#36 | 2006-03-09 ✅ Patent 7,423,885 granted on 2008-09-09Die module system
#37 | 2006-03-09 ✅ Patent 7,511,968 granted on 2009-03-31Buffered thin module system and method
#38 | 2006-03-09 ✅ Patent 7,480,152 granted on 2009-01-20Thin module system and method
#39 | 2006-03-09 ✅ Patent 7,542,297 granted on 2009-06-02Optimized mounting area circuit module system and method
#40 | 2006-03-09 ✅ Patent 7,606,049 granted on 2009-10-20Module thermal management system and method
#41 | 2006-03-09 ✅ Patent 7,468,893 granted on 2008-12-23Thin module system and method
#42 | 2006-01-12 ✅ Patent 7,524,703 granted on 2009-04-28Integrated circuit stacking system and method
#43 | 2005-12-22 ✅ Patent 7,495,334 granted on 2009-02-24Stacking system and method
#44 | 2005-12-01 ✅ Patent 7,595,550 granted on 2009-09-29Flex-based circuit module
#45 | 2005-03-17 ✅ Patent 7,542,304 granted on 2009-06-02Memory expansion and integrated circuit stacking system and method
#46 | 2005-02-24 ✅ Patent 7,586,758 granted on 2009-09-08Integrated circuit stacking system
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