Chien-Lan Hsueh

Low-Temperature Deposition of Metal Silicon Nitrides from Silicon Halide Precursors

DRAM MIMCAP Stack with MoO2 Electrode

Low-temperature deposition of nitrides by UV-assisted ALD or CVD

Systems and Methods for Parallel Combinatorial Vapor Deposition Processing

Metal organic chemical vapor deposition of embedded resistors for ReRAM cells

Methods of forming nitrides at low substrate temperatures

Low-temperature growth of complex compound films

High productivity combinatorial processing using pressure-controlled one-way valves

Metal organic chemical vapor deposition of resistive switching layers for ReRAM cells

Controlling composition of multiple oxides in resistive switching layers using atomic layer deposition

Confined defect profiling within resistive random memory access cells

Metal aluminum nitride embedded resistors for resistive random memory access cells

ReRAM cells including TaSiN embedded resistors

Controlling composition of multiple oxides in resistive switching layers using atomic layer deposition

Nonvolatile resistive memory element with a silicon-based switching layer

Confined defect profiling within resistive random memory access cells

Metal aluminum nitride embedded resistors for resistive random memory access cells

Resistive switching layers including Hf-Al-O

Using saturated and unsaturated ALD processes to deposit oxides as ReRAM switching layer

ReRAM cells including TaSiN embedded resistors

Using TiON as electrodes and switching layers in ReRAM devices

ReRAM stacks preparation by using single ALD or PVD chamber