Munich
Germany
10
2009-11-26
The entities that hold a legal rights for patent applications filed by inventor Legen Anton:
Anton Legen from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
HEAT SINK FOR AN ELECTRONIC DEVICE
#2 | 2009-05-28Assembly device and assembly method for a cooling element
#3 | 2009-05-21METHOD AND APPARATUS FOR HEAT TRANSFER
#4 | 2009-04-30MEMORY MODULE HEAT SINK
#5 | 2008-05-15Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same
#6 | 2008-02-07COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME
#7 | 2006-07-27Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement
#8 | 2006-03-09Substrate-based housing component with a semiconductor chip
#9 | 2006-01-26Method for mounting a chip on a base and arrangement produced by this method
#10 | 2005-05-17Electronic device having a stack of semiconductor chips and method for the production thereof
3933886 ⎘