Inventor profile of:

James W. Cady

City:

Austin, Texas

Country:

United States

Published Applications:

37

Last publication date:

2009-11-05

Top Assignees for applications by James W. Cady

The entities that hold a legal rights for patent applications filed by inventor Cady James W.:

Recent patent applications by Cady James W.

James W. Cady from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-11-05
US20090273069A1
Electricity

LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD

#2 | 2009-05-14
US20090124045A1
Electricity

Low profile stacking system and method

#3 | 2008-09-04
US20080211077A1
Electricity

Low profile chip scale stacking system and method

#4 | 2007-05-24
US20070117262A1
Electricity

Low Profile Stacking System and Method

#5 | 2007-05-24
US20070115017A1
Electricity

Thin module system and method

#6 | 2007-05-24
US20070114649A1
Electricity

Low Profile Stacking System and Method

#7 | 2006-11-23
US20060261449A1
Electricity

Memory module system and method

#8 | 2006-08-22
US10873847
-

Low profile chip scale stacking system and method

#9 | 2006-08-10
US20060175693A1
Electricity

Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit

#10 | 2006-06-27
US10449242
-

Flexible circuit connector for stacked chip module

#11 | 2006-06-22
US20060131716A1
Electricity

Stacking system and method

#12 | 2006-05-04
US20060091521A1
Electricity

Stacking system and method

#13 | 2006-04-11
US10631886
-

Low profile chip scale stacking system and method

#14 | 2006-03-09
US20060050592A1
Electricity

Compact module system and method

#15 | 2006-03-09
US20060050498A1
Electricity

Die module system

#16 | 2006-03-09
US20060050492A1
Electricity

Thin module system and method

#17 | 2006-03-09
US20060049502A1
Physics

Module thermal management system and method

#18 | 2006-03-09
US20060048385A1
Physics

Minimized profile circuit module systems and methods

#19 | 2006-03-02
US20060043558A1
Electricity

Stacked integrated circuit cascade signaling system and method

#20 | 2006-01-12
US20060008945A1
Electricity

Integrated circuit stacking system and method

#21 | 2005-12-22
US20050280135A1
Electricity

Stacking system and method

#22 | 2005-12-01
US20050263872A1
Electricity

Flex-based circuit module

#23 | 2005-10-18
US10814532
-

Integrated circuit stacking system and method

#24 | 2005-10-18
US10709732
-

Memory expansion and chip scale stacking system and method

#25 | 2005-09-06
US10136890
-

Integrated circuit stacking system and method

#26 | 2005-07-07
US20050146031A1
Electricity

Low profile stacking system and method

#27 | 2005-07-07
US20050146011A1
Electricity

Pitch change and chip scale stacking system and method

#28 | 2005-07-05
US10453398
-

Memory expansion and chip scale stacking system and method

#29 | 2005-03-31
US20050067683A1
Electricity

Memory expansion and chip scale stacking system and method

#30 | 2005-03-24
US20050062144A1
Electricity

Memory expansion and chip scale stacking system and method

#31 | 2005-03-17
US20050057911A1
Electricity

Memory expansion and integrated circuit stacking system and method

#32 | 2005-03-17
US20050056921A1
Electricity

Stacked module systems and methods

#33 | 2005-02-24
US20050041404A1
Electricity

Integrated circuit stacking system and method

#34 | 2005-02-24
US20050041403A1
Electricity

Integrated circuit stacking system

#35 | 2005-02-24
US20050041402A1
Electricity

Integrated circuit stacking system

#36 | 2005-01-27
US20050018412A1
Electricity

Pitch change and chip scale stacking system

#37 | 2005-01-13
US20050009234A1
Electricity

Stacked module systems and methods for CSP packages

InventorID:

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