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Inventor profile of:

Robert W. Batz

City:

Kalispell, Montana

Country:

United States

Published Applications:

9

Last publication date:

2008-01-17

Top Assignees for applications by Robert W. Batz

The entities that hold a legal rights for patent applications filed by inventor Batz Robert W.:

SEMITOOL, INC. 8 Kalispell, MT United States
Applied Materials, Inc. 2 Santa Clara, CA United States

Recent patent applications by Batz Robert W.

Robert W. Batz from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-01-17

US20080011450A1

Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces

#2 | 2007-03-29

US20070068820A1

Chemistry; metallurgy

Electrolytic copper process using anion permeable barrier

#3 | 2006-11-23

US20060260946A1

Chemistry; metallurgy

Copper electrolytic process using cation permeable barrier

#4 | 2006-10-26

US20060237323A1

Chemistry; metallurgy

Electrolytic process using cation permeable barrier

#5 | 2006-08-24

US20060189129A1

Chemistry; metallurgy

Method for applying metal features onto barrier layers using ion permeable barriers

#6 | 2006-07-27

US20060163072A1

Chemistry; metallurgy

Electrolytic process using anion permeable barrier

#7 | 2006-07-20

US20060157355A1

Chemistry; metallurgy

Electrolytic process using anion permeable barrier

#8 | 2005-09-22

US20050205111A1

Chemistry; metallurgy

Method and apparatus for processing a microfeature workpiece with multiple fluid streams

#9 | 2005-03-10

US20050051436A1

Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density

InventorID:

4094308 ⎘