Moritz Haupt

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2008-10-16

Top Assignees for applications by Moritz Haupt

The entities that hold a legal rights for patent applications filed by inventor Haupt Moritz:

Moritz Haupt from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for manufacturing an integrated circuit including a transistor

Capacitor with hemispherical silicon-germanium grains and a method for making the same

Gap-filling for isolation

Void free, silicon filled trenches in semiconductors

Fabrication method for a semiconductor structure

Method for N+ doping of amorphous silicon and polysilicon electrodes in deep trenches

InventorID:

4140362 ⎘