Maricopa, Arizona
United States
12
2014-06-26
The entities that hold a legal rights for patent applications filed by inventor Xu Dingying:
Dingying Xu from Maricopa, US has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBEDDED DIE PACKAGES
#2 | 2014-06-19Package with dielectric or anisotropic conductive (ACF) buildup layer
#3 | 2013-01-17Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
#4 | 2012-06-21Forming die backside coating structures with coreless packages
#5 | 2012-03-29Flexible underfill compositions for enhanced reliability
#6 | 2011-06-30Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same
#7 | 2011-06-23Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
#8 | 2010-10-21SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES
#9 | 2009-12-31SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES
#10 | 2009-01-01HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES
#11 | 2008-10-02In-situ formation of conductive filling material in through-silicon via
#12 | 2007-10-11Method, system, and apparatus for filling vias
41454 ⎘