Surendorf
Germany
38
2022-09-15
The entities that hold a legal rights for patent applications filed by inventor Eisele Ronald:
Ronald Eisele from Surendorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Power electronics module with improved cooling
#2 | 2022-09-15Compact power electronics module with increased cooling surface
#3 | 2021-07-08METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#4 | 2021-07-08METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#5 | 2021-07-08HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PRODUCING A HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN ELECTRONIC MODULE
#6 | 2021-07-01METHOD FOR PRODUCING A HEAT-SPREADING PLATE, HEAT-SPREADING PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#7 | 2021-04-08Process and device for low-temperature pressure sintering
#8 | 2021-01-21Sintering tool and method for sintering an electronic subassembly
#9 | 2019-11-07Power module
#10 | 2018-11-15Electronic sandwich structure with two parts joined together by means of a sintering layer
#11 | 2018-10-18METHOD FOR MANUFACTURING A CIRCUIT CARRIER
#12 | 2018-09-13Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
#13 | 2018-08-23Method for manufacturing semiconductor chips
#14 | 2018-08-02Power semiconductor module
#15 | 2017-12-21Power module
#16 | 2017-11-23POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
#17 | 2017-11-16Cooling trough, cooler and power module assembly
#18 | 2017-11-02Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
#19 | 2017-11-02Power semiconductor contact structure and method for the production thereof
#20 | 2017-08-10Process and device for low-temperature pressure sintering
#21 | 2017-08-10Sintering device
#22 | 2017-08-03Sintering tool for the lower die of a sintering device
#23 | 2017-08-03Sintering tool and method for sintering an electronic subassembly
#24 | 2017-05-11SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVERS AT LEAST ONE SEMICONDUCTOR COMPONENT
#25 | 2016-09-08Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
#26 | 2016-08-04Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#27 | 2014-08-21Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#28 | 2014-08-14Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#29 | 2013-09-05Power semiconductor module with method for manufacturing a sintered power semiconductor module
#30 | 2012-11-08Method of manufacturing a semiconductor component
#31 | 2012-02-16Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
#32 | 2011-10-20Rigid power module suited for high-voltage applications
#33 | 2011-01-27Method for the low-temperature pressure sintering of electronic units to heat sinks
#34 | 2010-11-04Method for manufacturing a rigid power module suited for high-voltage applications
#35 | 2007-09-20Fluid cooling system
#36 | 2007-09-13Power semiconductor module and method for cooling a power semiconductor module
#37 | 2005-08-18Cooling unit and flow distributing element for use in such unit
#38 | 2005-06-30Cooling device
421795 ⎘