Lappersdorf
Germany
63
2018-10-04
The entities that hold a legal rights for patent applications filed by inventor Brunnbauer Markus:
Markus Brunnbauer from Lappersdorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Carrier arrangement and method for processing a carrier by generating a crack structure
#2 | 2018-08-30Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly
#3 | 2018-08-16HANDLING THIN WAFER DURING CHIP MANUFACTURE
#4 | 2017-11-30Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly
#5 | 2017-10-26METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
#6 | 2017-04-20Method of dicing a wafer and semiconductor chip
#7 | 2016-07-21Method of dicing a wafer and semiconductor chip
#8 | 2016-06-09Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#9 | 2014-11-13Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#10 | 2014-07-17Semiconductor device with chip having low-k-layers
#11 | 2014-06-05CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
#12 | 2013-09-05Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#13 | 2012-11-15Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#14 | 2012-10-18Article and panel comprising semiconductor chips, casting mold and methods of producing the same
#15 | 2012-10-11Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#16 | 2012-09-20ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE
#17 | 2012-08-16On-Chip RF shields with front side redistribution lines
#18 | 2012-08-09Mold method
#19 | 2012-05-03Semiconductor module having a semiconductor chip stack and method
#20 | 2011-11-24Method for producing chip packages, and chip package produced in this way
#21 | 2011-03-24Component and method for producing a component
#22 | 2011-02-03Stacked semiconductor chips
#23 | 2011-02-03Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip
#24 | 2011-02-03Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#25 | 2010-09-23Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#26 | 2010-09-16Reconfigured wafer alignment
#27 | 2010-08-19Semiconductor device including conductive element
#28 | 2010-08-05Semiconductor device
#29 | 2010-04-01On-chip RF shields with front side redistribution lines
#30 | 2010-04-01On-chip radio frequency shield with interconnect metallization
#31 | 2009-12-03SEMICONDUCTOR DEVICE
#32 | 2009-10-22Semiconductor module
#33 | 2009-06-18Semiconductor device
#34 | 2009-04-30Semiconductor device
#35 | 2009-04-09Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#36 | 2009-03-26Stacked semiconductor chips
#37 | 2009-03-26INTEGRATED CIRCUIT DEVICE
#38 | 2009-02-19Integrated circuit including parylene material layer
#39 | 2009-01-15Semiconductor device
#40 | 2009-01-08Stackable semiconductor package with encapsulant and electrically conductive feed-through
#41 | 2008-10-30Structure for electrostatic discharge in embedded wafer level packages
#42 | 2008-10-30Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
#43 | 2008-10-16Encapsulation method
#44 | 2008-09-18Article and panel comprising semiconductor chips, casting mold and methods of producing the same
#45 | 2008-07-31Method for producing a device and device
#46 | 2008-07-10Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip
#47 | 2008-06-12Semiconductor component including a semiconductor chip and a passive component
#48 | 2008-02-14Electronic device and method for producing a device
#49 | 2008-01-17Component and method for producing a component
#50 | 2008-01-17Method for producing chip packages, and chip package produced in this way
#51 | 2007-12-06Producing thin integrated semiconductor devices
#52 | 2007-10-25PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC
#53 | 2007-10-11Mold apparatus and method
#54 | 2007-10-11Semiconductor device having an adhesion promoting layer and method for producing it
#55 | 2007-09-20Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#56 | 2007-09-06Composite board with semiconductor chips and plastic housing composition and method
#57 | 2007-08-02Semiconductor module having a semiconductor chip stack and method
#58 | 2007-07-19Semiconductor module comprising semiconductor chips and method for producing the same
#59 | 2007-05-24Electronic structure with components connected by way of solderable connecting elements and method
#60 | 2007-05-03Heat treatment for a panel and apparatus for carrying out the heat treatment method
#61 | 2007-02-01Semiconductor stack block comprising semiconductor chips and methods for producing the same
#62 | 2006-12-07Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
#63 | 2006-12-07Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover
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