Taichung
Taiwan
124
2026-03-26
The entities that hold a legal rights for patent applications filed by inventor PU Han-Ping:
Han-Ping PU from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#2 | 2025-11-13METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT
#3 | 2025-11-06Conductive Traces in Semiconductor Devices and Methods of Forming Same
#4 | 2024-11-21SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#5 | 2024-11-21MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
#6 | 2024-11-21SEMICONDUCTOR DEVICE AND METHOD
#7 | 2024-11-21SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
#8 | 2024-04-25Conductive Traces in Semiconductor Devices and Methods of Forming Same
#9 | 2023-11-23Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
#10 | 2023-11-23Semiconductor packages and methods of forming the same
#11 | 2023-09-28Semiconductor device having antenna and manufacturing method thereof
#12 | 2023-03-30METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT
#13 | 2022-12-01Integrated fan-out packaging
#14 | 2022-12-01Semiconductor device and method
#15 | 2022-11-10Semiconductor package and manufacturing method thereof
#16 | 2022-11-10MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
#17 | 2022-10-20PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#18 | 2022-10-20PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#19 | 2022-08-11Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
#20 | 2022-08-04Memory device and manufacturing method thereof
#21 | 2022-01-13Memory device and manufacturing method thereof
#22 | 2021-11-11Integrated fan-out packages and methods of forming the same
#23 | 2021-07-01Memory device and manufacturing method thereof
#24 | 2021-06-17Semiconductor package and manufacturing method thereof
#25 | 2021-06-17Conductive traces in semiconductor devices and methods of forming same
#26 | 2021-04-01Integrated fan-out packaging
#27 | 2021-01-14Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
#28 | 2020-10-29Package structure and manufacturing method thereof
#29 | 2020-10-22Integrated fan-out package and manufacturing method thereof
#30 | 2020-10-22Semiconductor device having antenna on chip package and manufacturing method thereof
#31 | 2020-10-22Semiconductor package and manufacturing method thereof
#32 | 2020-08-27Semiconductor device and manufacturing method thereof
#33 | 2020-07-30Package structure and manufacturing method thereof
#34 | 2020-05-28Semiconductor device package including embedded conductive elements
#35 | 2020-05-14Integrated fan-out package with antenna components and manufacturing method thereof
#36 | 2020-04-16Semiconductor package structure
#37 | 2020-04-02Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same
#38 | 2020-03-19Semiconductor package, semiconductor device and method for packaging semiconductor device
#39 | 2020-03-05Package structure and method of manufacturing the same
#40 | 2020-01-30Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same
#41 | 2020-01-23Semiconductor device and method
#42 | 2020-01-16Integrated fan-out packages and methods of forming the same
#43 | 2019-11-26Packaging of semiconductor device with antenna and heat spreader
#44 | 2019-11-21Method of manufacturing integrated fan-out package
#45 | 2019-11-21Package structure and manufacturing method thereof
#46 | 2019-10-31Semiconductor device having antenna and manufacturing method thereof
#47 | 2019-08-01Integrated fan-out packaging
#48 | 2019-07-30Method of manufacturing integrated fan-out package
#49 | 2019-05-23Package structure having connecting module
#50 | 2019-05-09Integrated fan-out package and manufacturing method thereof
#51 | 2019-03-28Semiconductor packages and methods of forming same
#52 | 2019-03-28Package structure and method of manufacturing the same
#53 | 2019-03-28Semiconductor package structure
#54 | 2019-03-28Semiconductor device and method
#55 | 2019-02-28Package structure and method of fabricating package structure
#56 | 2019-01-31Semiconductor device and semiconductor package
#57 | 2018-09-20Semiconductor packages and methods of forming same
#58 | 2018-05-24Integrated fan-out packaging
#59 | 2018-05-10Semiconductor device structure
#60 | 2018-01-18Semiconductor device structure and method for forming the same
#61 | 2017-08-31Conductive traces in semiconductor devices and methods of forming same
#62 | 2017-05-30Semiconductor device
#63 | 2017-05-25On-chip electromagnetic bandgap (EBG) structure for noise suppression
#64 | 2017-03-16Method of forming 3D integrated circuit package with panel type lid
#65 | 2016-11-24Mechanisms of forming connectors for package on package
#66 | 2016-10-20Conductive traces in semiconductor devices and methods of forming same
#67 | 2016-06-16Pre-applying supporting materials between bonded package components
#68 | 2016-01-21Copper-containing layer on under-bump metallization layer
#69 | 2015-10-22Zero stand-off bonding system and method
#70 | 2015-10-08Protecting flip-chip package using pre-applied fillet
#71 | 2015-09-173D integrated circuit package processing with panel type lid
#72 | 2015-08-27Package structure and method of forming the same
#73 | 2015-05-28Packages with molding material forming steps
#74 | 2014-09-18Package-on-package structure
#75 | 2014-09-18Packages with molding material forming steps
#76 | 2014-07-24Pre-applying supporting materials between bonded package components
#77 | 2014-07-10Bumps for chip scale packaging including under bump metal structures with different diameters
#78 | 2014-07-03Zero stand-off bonding system and method
#79 | 2013-10-24Methods and Apparatus for bump-on-trace Chip Packaging
#80 | 2013-08-29Mechanisms for forming connectors with a molding compound for package on package
#81 | 2013-07-25Crack stopper on under-bump metallization layer
#82 | 2013-07-11Stress compensation layer for 3D packaging
#83 | 2013-07-04Methods and apparatus for package on package devices with reduced strain
#84 | 2013-05-23Mechanisms for forming fine-pitch copper bump structures
#85 | 2013-05-23Die carrier for package on package assembly
#86 | 2013-05-16Bumps for Chip Scale Packaging
#87 | 2013-01-03Bump-on-trace (BOT) structures
#88 | 2012-12-20Wafer level chip scale package with reduced stress on solder balls
#89 | 2012-12-06Thermally Enhanced Integrated Circuit Package
#90 | 2012-11-01Reduced-stress bump-on-trace (BOT) structures
#91 | 2012-08-30Extending metal traces in bump-on-trace structures
#92 | 2012-05-17Protecting flip-chip package using pre-applied fillet
#93 | 2011-12-08Fabrication method of leadframe-based semiconductor package
#94 | 2011-03-24Method for fabricating stack structure of semiconductor packages
#95 | 2011-03-10Enhanced copper posts for wafer level chip scale packaging
#96 | 2011-01-18Method of semiconductor packaging
#97 | 2010-11-04Method and system of testing a semiconductor device
#98 | 2010-10-21Method of fabricating stacked semiconductor structure
#99 | 2010-09-16Method for fabricating chip scale package structure with metal pads exposed from an encapsulant
#100 | 2010-06-17Fabrication method of semiconductor package having heat dissipation device
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