Holman Chen

City:

Taichung

Country:

Taiwan

Published Applications:

Last publication date:

2007-01-11

Top Assignees for applications by Holman Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Holman:

Holman Chen from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Wire-bonding method and semiconductor package using the same

Wire-bonding method and semiconductor package using the same

Lead-frame-based semiconductor package and fabrication method thereof

InventorID:

4331774 ⎘