Cecile Berne

City:

Grenoble

Country:

France

Published Applications:

Last publication date:

2007-05-31

Top Assignees for applications by Cecile Berne

The entities that hold a legal rights for patent applications filed by inventor Berne Cecile:

Cecile Berne from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

Substrate layer cutting device and method

Substrate layer cutting device and method

Two-stage annealing method for manufacturing semiconductor substrates

InventorID:

4422328 ⎘