Bernin
France
84
2012-07-26
81
2013-07-02
These are the the leading inventors for applications assigned to S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES, S.A.:
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES, S.A. based in Bernin, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
EPITAXIAL METHODS FOR REDUCING SURFACE DISLOCATION DENSITY IN SEMICONDUCTOR MATERIALS
#2 | 2010-11-04 ✅ Patent 8,476,148 granted on 2013-07-02Method for transferring a layer from a donor substrate onto a handle substrate
#3 | 2010-09-30 ✅ Patent 8,178,427 granted on 2012-05-15Epitaxial methods for reducing surface dislocation density in semiconductor materials
#4 | 2010-07-29EPITAXIAL METHODS AND STRUCTURES FOR FORMING SEMICONDUCTOR MATERIALS
#5 | 2010-07-22 ✅ Patent 8,324,075 granted on 2012-12-04Methods for recycling substrates and fabricating laminated wafers
#6 | 2010-06-10 ✅ Patent 8,461,055 granted on 2013-06-11Process for preparing cleaned surfaces of strained silicon
#7 | 2010-05-27 ✅ Patent 8,679,942 granted on 2014-03-25Strain engineered composite semiconductor substrates and methods of forming same
#8 | 2010-05-06 ✅ Patent 8,278,193 granted on 2012-10-02Methods of forming layers of semiconductor material having reduced lattice strain, semiconductor structures, devices and engineered substrates including same
#9 | 2010-01-14 ✅ Patent 7,825,401 granted on 2010-11-02Strained layers within semiconductor buffer structures
#10 | 2007-06-28 ✅ Patent 7,892,946 granted on 2011-02-22Device and method for cutting an assembly
#11 | 2007-05-31 ✅ Patent 7,406,994 granted on 2008-08-05Substrate layer cutting device and method
#12 | 2007-05-31 ✅ Patent 8,083,115 granted on 2011-12-27Substrate cutting device and method
#13 | 2007-05-10METHOD OF MANUFACTURING A MATERIAL COMPOUND WAFER
#14 | 2007-05-10 ✅ Patent 7,439,160 granted on 2008-10-21Methods for producing a semiconductor entity
#15 | 2007-04-26 ✅ Patent 7,740,735 granted on 2010-06-22Tools and methods for disuniting semiconductor wafers
#16 | 2007-03-13 ✅ Patent 7,189,304 granted on 2007-03-13Substrate layer cutting device and method
#17 | 2007-03-06 ✅ Patent 7,187,162 granted on 2007-03-06Tools and methods for disuniting semiconductor wafers
#18 | 2007-01-16 ✅ Patent 7,163,897 granted on 2007-01-16Method for assaying elements in a substrate for optics, electronics, or optoelectronics
#19 | 2006-12-21 ✅ Patent 7,407,867 granted on 2008-08-05Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
#20 | 2006-12-21 ✅ Patent 7,225,095 granted on 2007-05-29Thermal processing equipment calibration method
#21 | 2006-11-21 ✅ Patent 7,138,344 granted on 2006-11-21Method for minimizing slip line faults on a semiconductor wafer surface
#22 | 2006-10-17 ✅ Patent 7,122,095 granted on 2006-10-17Methods for forming an assembly for transfer of a useful layer
#23 | 2006-10-03 ✅ Patent 7,115,481 granted on 2006-10-03Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
#24 | 2006-09-28 ✅ Patent 7,405,135 granted on 2008-07-29Substrate for stressed systems and method of making same
#25 | 2006-08-29 ✅ Patent 7,098,148 granted on 2006-08-29Method for heat treating a semiconductor wafer
#26 | 2006-08-22 ✅ Patent 7,094,668 granted on 2006-08-22Annealing process and device of semiconductor wafer
#27 | 2006-07-04 ✅ Patent 7,071,077 granted on 2006-07-04Method for preparing a bonding surface of a semiconductor layer of a wafer
#28 | 2006-06-15 ✅ Patent 7,736,988 granted on 2010-06-15Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
#29 | 2006-06-06 ✅ Patent 7,056,809 granted on 2006-06-06Method for ion treating a semiconductor material for subsequent bonding
#30 | 2006-05-25 ✅ Patent 7,229,898 granted on 2007-06-12Methods for fabricating a germanium on insulator wafer
#31 | 2006-05-04 ✅ Patent 7,135,383 granted on 2006-11-14Composite structure with high heat dissipation
#32 | 2006-04-27 ✅ Patent 7,232,743 granted on 2007-06-19Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
#33 | 2006-04-25 ✅ Patent 7,033,905 granted on 2006-04-25Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means
#34 | 2006-04-18 ✅ Patent 7,029,993 granted on 2006-04-18Method for treating substrates for microelectronics and substrates obtained according to said method
#35 | 2006-04-13 ✅ Patent 7,163,873 granted on 2007-01-16Substrate for stressed systems and method of making same
#36 | 2006-04-13 ✅ Patent 7,145,214 granted on 2006-12-05Substrate for stressed systems and method of making same
#37 | 2006-04-13 ✅ Patent 7,378,729 granted on 2008-05-27Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
#38 | 2006-04-04 ✅ Patent 7,022,586 granted on 2006-04-04Method for recycling a substrate
#39 | 2006-03-28 ✅ Patent 7,018,909 granted on 2006-03-28Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
#40 | 2006-03-28 ✅ Patent 7,017,570 granted on 2006-03-28Apparatus and method for splitting substrates
#41 | 2006-03-28 ✅ Patent 7,018,910 granted on 2006-03-28Transfer of a thin layer from a wafer comprising a buffer layer
#42 | 2006-03-23 ✅ Patent 7,535,115 granted on 2009-05-19Wafer and method of producing a substrate by transfer of a layer that includes foreign species
#43 | 2006-03-07 ✅ Patent 7,008,857 granted on 2006-03-07Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
#44 | 2006-03-07 ✅ Patent 7,009,270 granted on 2006-03-07Substrate for stressed systems and method of making same
#45 | 2006-03-07 ✅ Patent 7,008,859 granted on 2006-03-07Wafer and method of producing a substrate by transfer of a layer that includes foreign species
#46 | 2006-02-21 ✅ Patent 7,001,826 granted on 2006-02-21Wafer with a relaxed useful layer and method of forming the wafer
#47 | 2006-02-07 ✅ Patent 6,995,427 granted on 2006-02-07Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
#48 | 2006-01-31 ✅ Patent 6,991,995 granted on 2006-01-31Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer
#49 | 2006-01-24 ✅ Patent 6,989,314 granted on 2006-01-24Semiconductor structure and method of making same
#50 | 2006-01-24 ✅ Patent 6,988,936 granted on 2006-01-24Surface preparation for receiving processing treatments
#51 | 2006-01-17 ✅ Patent 6,987,051 granted on 2006-01-17Method of making cavities in a semiconductor wafer
#52 | 2005-12-15 ✅ Patent 7,138,325 granted on 2006-11-21Method of manufacturing a wafer
#53 | 2005-12-01 ✅ Patent 7,262,113 granted on 2007-08-28Methods for transferring a useful layer of silicon carbide to a receiving substrate
#54 | 2005-11-15 ✅ Patent 6,964,914 granted on 2005-11-15Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material
#55 | 2005-11-08 ✅ Patent 6,962,858 granted on 2005-11-08Method for reducing free surface roughness of a semiconductor wafer
#56 | 2005-10-25 ✅ Patent 6,958,284 granted on 2005-10-25Method of smoothing the outline of a useful layer of material transferred onto a support substrate
#57 | 2005-10-20 ✅ Patent 7,190,029 granted on 2007-03-13Preventive treatment method for a multilayer semiconductor wafer
#58 | 2005-10-18 ✅ Patent 6,955,971 granted on 2005-10-18Semiconductor structure and methods for fabricating same
#59 | 2005-10-11 ✅ Patent 6,953,736 granted on 2005-10-11Process for transferring a layer of strained semiconductor material
#60 | 2005-09-22 ✅ Patent 7,235,427 granted on 2007-06-26Method for treating substrates for microelectronics and substrates obtained by said method
#61 | 2005-09-20 ✅ Patent 6,946,317 granted on 2005-09-20Method of fabricating heteroepitaxial microstructures
#62 | 2005-09-15 ✅ Patent 7,001,832 granted on 2006-02-21Method for limiting slip lines in a semiconductor substrate
#63 | 2005-09-06 ✅ Patent 6,939,783 granted on 2005-09-06Preventive treatment method for a multilayer semiconductor wafer
#64 | 2005-09-01 ✅ Patent 6,991,956 granted on 2006-01-31Methods for transferring a thin layer from a wafer having a buffer layer
#65 | 2005-08-30 ✅ Patent 6,936,523 granted on 2005-08-30Two-stage annealing method for manufacturing semiconductor substrates
#66 | 2005-08-30 ✅ Patent 6,936,482 granted on 2005-08-30Method of fabricating substrates and substrates obtained by this method
#67 | 2005-07-14 ✅ Patent 7,221,038 granted on 2007-05-22Method of fabricating substrates and substrates obtained by this method
#68 | 2005-06-07 ✅ Patent 6,903,032 granted on 2005-06-07Method for preparing a semiconductor wafer surface
#69 | 2005-06-07 ✅ Patent 6,902,988 granted on 2005-06-07Method for treating substrates for microelectronics and substrates obtained by said method
#70 | 2005-05-26 ✅ Patent 7,041,577 granted on 2006-05-09Process for manufacturing a substrate and associated substrate
#71 | 2005-05-12 ✅ Patent 7,071,029 granted on 2006-07-04Methods for fabricating final substrates
#72 | 2005-05-12 ✅ Patent 7,300,856 granted on 2007-11-27Process for detaching layers of material
#73 | 2005-05-05 ✅ Patent 7,049,250 granted on 2006-05-23Heat treatment for edges of multilayer semiconductor wafers
#74 | 2005-03-31 ✅ Patent 7,078,353 granted on 2006-07-18Indirect bonding with disappearance of bonding layer
#75 | 2005-03-03 ✅ Patent 7,189,632 granted on 2007-03-13Multifunctional metallic bonding
#76 | 2005-02-10 ✅ Patent 6,974,760 granted on 2005-12-13Methods for transferring a useful layer of silicon carbide to a receiving substrate
#77 | 2005-02-03 ✅ Patent 7,081,399 granted on 2006-07-25Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations
#78 | 2005-02-03 ✅ Patent 7,169,683 granted on 2007-01-30Preventive treatment method for a multilayer semiconductor structure
#79 | 2005-01-27 ✅ Patent 7,060,620 granted on 2006-06-13Method of preparing a surface of a semiconductor wafer to make it epiready
#80 | 2005-01-13 ✅ Patent 7,018,913 granted on 2006-03-28Method for implanting atomic species through an uneven surface of a semiconductor layer
#81 | 2005-01-13 ✅ Patent 6,982,210 granted on 2006-01-03Method for manufacturing a multilayer semiconductor structure that includes an irregular layer
#82 | 2005-01-13 ✅ Patent 7,067,393 granted on 2006-06-27Substrate assembly for stressed systems
#83 | 2005-01-06 ✅ Patent 7,182,234 granted on 2007-02-27Substrate cutting device and method
#84 | 2005-01-04 ✅ Patent 6,838,358 granted on 2005-01-04Method of manufacturing a wafer
186997 ⎘