Austin, Texas
United States
18
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor Alfano Michael:
Michael Alfano from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES
#2 | 2025-10-02Through Package Vertical Interconnect and Method of Making Same
#3 | 2025-09-18Through Package Vertical Interconnect and Method of Making Same
#4 | 2025-08-28Semiconductor Package with Integrated Capacitors
#5 | 2025-06-26EMBEDDED VOLTAGE REGULATION MODULE
#6 | 2025-01-09Semiconductor Package with Integrated Capacitors
#7 | 2024-10-10Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive Substrate
#8 | 2024-08-01Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive Inks
#9 | 2024-04-11Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates
#10 | 2023-12-21Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate
#11 | 2023-12-07Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same
#12 | 2023-10-26Through Package Vertical Interconnect and Method of Making Same
#13 | 2023-09-14Semiconductor package with integrated capacitors
#14 | 2013-12-26SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
#15 | 2013-12-26Interposer with identification system
#16 | 2013-10-03DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
#17 | 2013-10-03STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#18 | 2013-10-03Thermal management of stacked semiconductor chips with electrically non-functional interconnects
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