Shanghai
China
45
2026-03-26
The entities that hold a legal rights for patent applications filed by inventor Wei Xing:
Xing Wei from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
CRYSTAL GROWING APPARATUS AND RF-SOI SUBSTRATE
#2 | 2026-01-29SEALANT COMPOSITION
#3 | 2026-01-01METHOD FOR REINFORCING BONDED WAFER
#4 | 2026-01-01METHOD FOR OXIDATION OF TOP SILICON LAYER IN BONDED WAFER
#5 | 2025-12-25STEEL STRIP AND MANUFACTURING METHOD THEREFOR
#6 | 2024-11-21STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CHARGE CAPTURE LAYER AND MANUFACTURE THEREOF
#7 | 2024-11-21STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CHARGE CAPTURE LAYER AND MANUFACTURE THEREOF
#8 | 2024-07-04CRYSTAL GROWING METHOD, APPARATUS AND RF-SOI SUBSTRATE
#9 | 2024-06-06METHOD FOR DETERMINING TYPES OF DEFECTS IN MONOCRYSTALLINE SILICON WAFER
#10 | 2024-05-09METHOD FOR PREPARING SILICON-ON-INSULATOR
#11 | 2024-05-02PREPARATION METHOD OF P-TYPE HIGH-RESISTANCE AND ULTRA-HIGH-RESISTANCE CZOCHRALSKI MONOCRYSTALLINE SILICON SUBSTRATE
#12 | 2024-03-21SOI WAFER
#13 | 2023-10-12METHOD OF GROWING A SINGLE-CRYSTAL SILICON
#14 | 2023-06-08SEMICONDUCTOR SUBSTRATE AND MANUFACTURE THEREOF
#15 | 2023-05-04METHOD FOR TREATING A WAFER SURFACE
#16 | 2023-05-04METHOD FOR IMPROVING THE SURFACE ROUGHNESS OF A SILICON-ON-INSULATOR WAFER
#17 | 2023-05-04SURFACE TREATMENT OF SOI WAFER
#18 | 2023-05-04SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME
#19 | 2023-05-04PROCESS OF SURFACE TREATMENT OF SOI WAFER
#20 | 2023-05-04SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE SAME
#21 | 2023-02-09MEASURING METHOD OF RESISTIVITY OF A WAFER
#22 | 2023-02-09METHOD FOR VERIFICATION OF CONDUCTIVITY TYPE OF SILICON WAFER
#23 | 2023-01-26SEALANT COMPOSITION
#24 | 2022-10-20METHOD OF DETECTING CRYSTALLOGRAPHIC DEFECTS AND METHOD OF GROWING AN INGOT
#25 | 2022-09-15Method for characterizing defects in silicon crystal
#26 | 2022-06-09Silicon on insulator structure and method of making the same
#27 | 2022-06-09Silicon on insulator structure and method of making the same
#28 | 2022-01-06COMPOSITE HEAT INSULATION STRUCTURE FOR MONOCRYSTALLINE SILICON GROWTH FURNACE AND MONOCRYSTALLINE SILICON GROWTH FURNACE
#29 | 2022-01-06HEAT SHIELD DEVICE FOR SINGLE CRYSTAL PRODUCTION FURNACE, CONTROL METHOD THEREOF AND SINGLE CRYSTAL PRODUCTION FURNACE
#30 | 2022-01-06HEAT SHIELD DEVICE FOR INSULATING HEAT AND SMELTING FURNACE
#31 | 2022-01-06HEAT SHIELD DEVICE AND SMELTING FURNACE
#32 | 2022-01-06THIN-FILM HEAT INSULATION SHEET FOR MONOCRYSTALLINE SILICON GROWTH FURNACE AND MONOCRYSTALLINE SILICON GROWTH FURNACE
#33 | 2022-01-06HEAT SHIELD FOR MONOCRYSTALLINE SILICON GROWTH FURNACE AND MONOCRYSTALLINE SILICON GROWTH FURNACE
#34 | 2022-01-06Heat shield structure for single crystal production furnace and single crystal production furnace
#35 | 2020-05-28METHOD FOR PLANARIZING WAFER SURFACE
#36 | 2020-05-28METHOD FOR PLANARIZING WAFER SURFACE
#37 | 2020-03-26Bonding method for semiconductor substrate, and bonded semiconductor substrate
#38 | 2018-11-15Annealing method for improving bonding strength
#39 | 2018-07-12Method for preparing substrate with insulated buried layer
#40 | 2018-07-05Method for preparing substrate with carrier trapping center
#41 | 2018-06-28METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER
#42 | 2018-06-28Method for cleaning bonding interface before bonding
#43 | 2015-11-12METHOD FOR PREPARING MATERIAL ON INSULATOR BASED ON ENHANCED ADSORPTION
#44 | 2013-10-17Method for preparing semiconductor substrate with insulating buried layer gettering process
#45 | 2012-05-10ESD protection devices for SOI integrated circuit and manufacturing method thereof
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