William K. Barth

City:

Gresham, Oregon

Country:

United States

Published Applications:

Last publication date:

2007-01-09

Top Assignees for applications by William K. Barth

The entities that hold a legal rights for patent applications filed by inventor Barth William K.:

William K. Barth from Gresham, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Inter-layer interconnection structure for large electrical connections

Dual damascene interconnect structure with improved electro migration lifetimes

Method for creating barrier layers for copper diffusion

Dual damascene interconnect structure with improved electro migration lifetimes

InventorID:

4900695 ⎘