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Inventor profile of:

Randy A. Harris

City:

Kalispell, Montana

Country:

United States

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Randy A. Harris

The entities that hold a legal rights for patent applications filed by inventor Harris Randy A.:

Applied Materials, Inc. 12 Santa Clara, CA United States
SEMITOOL, INC. 10 Kalispell, MT United States
APPLIED MATERIALS, INC. 1 Kalispell, MT United States

Recent patent applications by Harris Randy A.

Randy A. Harris from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12

US20260047380A1

Electricity

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

#2 | 2026-01-08

US20260009587A1

Mechanical engineering

HIGH PERFORMANCE HEAT EXCHANGER

#3 | 2025-10-30

US20250336664A1

Electricity

GAS ATOMIZED PREWETTING CHAMBER AND CLEANING SYSTEM AND METHOD

#4 | 2025-10-30

US20250336056A1

Physics

IN SITU WAFER SEAL CHUCK DEFECTS IDENTIFICATION

#5 | 2025-04-10

US20250116028A1

Chemistry; metallurgy

ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER

#6 | 2024-06-13

US20240194503A1

Electricity

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

#7 | 2022-08-18

US20220262653A1

Electricity

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

#8 | 2022-08-18

US20220262652A1

Electricity

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

#9 | 2017-01-12

US20170009367A1

Chemistry; metallurgy

Wafer electroplating chuck assembly

#10 | 2016-08-18

US20160237584A1

Chemistry; metallurgy

ELECTROPLATING WITH REDUCED AIR BUBBLE DEFECTS

#11 | 2016-08-04

US20160225656A1

Electricity

Wafer processing system with chuck assembly maintenance module

#12 | 2015-03-19

US20150075976A1

Chemistry; metallurgy

ELECTROPLATING PROCESSOR WITH GEOMETRIC ELECTROLYTE FLOW PATH

#13 | 2014-09-18

US20140262795A1

Chemistry; metallurgy

ELECTROPLATING PROCESSOR WITH VACUUM ROTOR

#14 | 2014-03-27

US20140083862A1

Chemistry; metallurgy

Electroplating apparatus with contact ring deplating

#15 | 2013-11-14

US20130299343A1

Chemistry; metallurgy

Electroplating processor with geometric electrolyte flow path

#16 | 2013-05-30

US20130134035A1

Chemistry; metallurgy

Contact ring for an electrochemical processor

#17 | 2009-01-22

US20090024244A1

Electricity

High throughput semiconductor wafer processing

#18 | 2009-01-22

US20090022574A1

Electricity

WORKPIECE LOADING SYSTEM

#19 | 2008-07-10

US20080163898A1

Electricity

System for processing a workpiece

#20 | 2008-02-26

US10194939

End-effectors for handling microelectronic wafers

#21 | 2008-01-10

US20080006617A1

Mechanical engineering

Thermal wafer processor

#22 | 2007-10-16

US10195137

End-effectors for handling microelectronic workpieces

#23 | 2007-06-07

US20070125404A1

Performing operations; transporting

Apparatus and method for cleaning and drying a container for semiconductor workpieces

#24 | 2007-05-10

US20070104559A1

Electricity

End-effectors for handling microelectronic workpieces

#25 | 2007-01-18

US20070014656A1

Electricity

End-effectors and associated control and guidance systems and methods

#26 | 2006-10-03

US10621037

Apparatuses and method for transferring and/or pre-processing microelectronic workpieces

#27 | 2006-03-02

US20060045666A1

Electricity

Modular tool unit for processing of microfeature workpieces

#28 | 2006-01-12

US20060009047A1

Electricity

Modular tool unit for processing microelectronic workpieces

#29 | 2005-11-29

US10622018

Method and apparatus for securing microelectronic workpiece containers

#30 | 2005-03-24

US20050063798A1

Performing operations; transporting

Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces

#31 | 2005-03-24

US20050061438A1

Electricity

Integrated tool with interchangeable wet processing components for processing microfeature workpieces

#32 | 2005-03-10

US20050050767A1

Chemistry; metallurgy

Wet chemical processing chambers for processing microfeature workpieces

#33 | 2005-02-17

US20050034809A1

Electricity

Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems

InventorID:

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