Williston, Vermont
United States
19
2026-04-23
The entities that hold a legal rights for patent applications filed by inventor GUTWIN Paul:
Paul GUTWIN from Williston, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR STRUCTURE HAVING STACKED GATES AND METHOD OF MANUFACTURE THEREOF
#2 | 2025-04-10WIRING IN DIFFUSION BREAKS IN AN INTEGRATED CIRCUIT
#3 | 2025-04-03BACKSIDE POWER GATING
#4 | 2024-07-04BEOL CONTACT METALS FOR 2D TRANSISTORS
#5 | 2023-03-30Three-dimensional semiconductor device
#6 | 2023-03-16TAPERED DEVICE FOR LATERAL GATE ALL AROUND DEVICES
#7 | 2023-02-02SELF-ALIGNED METHOD FOR VERTICAL RECESS FOR 3D DEVICE INTEGRATION
#8 | 2023-01-19INDEPENDENT GATE CONTACTS FOR CFET
#9 | 2022-12-29SEMICONDUCTOR STRUCTURE HAVING STACKED GATES AND METHOD OF MANUFACTURE THEREOF
#10 | 2022-11-17INVERTED CROSS-COUPLE FOR TOP-TIER FET FOR MULTI-TIER GATE-ON-GATE 3DI
#11 | 2022-09-22Three-dimensional memory cell structure
#12 | 2022-07-14Integrated high efficiency gate on gate cooling
#13 | 2022-07-14Integrated high efficiency transistor cooling
#14 | 2022-06-09Inter-level handshake for dense 3D logic integration
#15 | 2022-06-09Stacked three-dimensional field-effect transistors
#16 | 2022-06-09Interdigitated device stack
#17 | 2022-06-09Multi-tier backside power delivery network for dense gate-on-gate 3D logic
#18 | 2022-06-09Inter-tier power delivery network (PDN) for dense gate-on-gate 3D logic integration
#19 | 2022-06-09Power-tap pass-through to connect a buried power rail to front-side power distribution network
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