Alois Nitsch

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2023-12-28

Top Assignees for applications by Alois Nitsch

The entities that hold a legal rights for patent applications filed by inventor Nitsch Alois:

Alois Nitsch from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS

Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck

Semiconductor device including an interconnect

InventorID:

5949919 ⎘