Kalispell, Montana
United States
138
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor Wilson Gregory J.:
Gregory J. Wilson from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#2 | 2025-12-04ELECTROPLATING WAFER SEAL APEX CLEANING TOOL
#3 | 2025-11-27PBN Heaters For ALD Temperature Uniformity
#4 | 2025-11-13COPLANARITY IMPROVEMENT OF HIGH-RATE CU PILLAR PROCESSES USING HIGH AGITATION TO ENABLE USE OF HIGH ACID, LOW CU CHEMISTRIES
#5 | 2025-11-13ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
#6 | 2025-11-06GAS ATOMIZED FLUID CLEAN OF ELECTROPLATING CHUCK IN MAINTENANCE CHAMBER
#7 | 2025-11-06GAS ATOMIZED FLUID CLEAN OF ELECTROPLATING CHUCK IN MAINTENANCE CHAMBER
#8 | 2025-07-17VERTICALLY ADJUSTABLE PLASMA SOURCE
#9 | 2025-06-12FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING WAFER ELECTROPLATING
#10 | 2025-04-10ANNEAL CHAMBER
#11 | 2025-04-10ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
#12 | 2025-01-02ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#13 | 2024-02-29Methods, systems, and apparatus for tape-frame substrate cleaning and drying
#14 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#15 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#16 | 2023-09-28Vertically adjustable plasma source
#17 | 2023-08-17Parameter adjustment model for semiconductor processing chambers
#18 | 2023-07-27SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS
#19 | 2023-07-06Methods, systems, and apparatus for tape-frame substrate cleaning and drying
#20 | 2023-06-22Mechanically-driven oscillating flow agitation
#21 | 2023-06-01Electroplating system
#22 | 2023-03-23ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
#23 | 2022-08-25Systems and methods for improving within die co-planarity uniformity
#24 | 2022-06-30Vertically adjustable plasma source
#25 | 2022-05-12Electroplating system
#26 | 2022-05-12Mechanically-driven oscillating flow agitation
#27 | 2022-04-28Multi-compartment electrochemical replenishment cell
#28 | 2021-11-11Electroplating system
#29 | 2021-04-08Mechanically-driven oscillating flow agitation
#30 | 2021-03-25PBN Heaters For ALD Temperature Uniformity
#31 | 2020-12-10Apparatus for post exposure bake
#32 | 2020-03-26Systems and methods for improving within die co-planarity uniformity
#33 | 2019-10-24Cleaning components and methods in a plating system
#34 | 2019-10-03Substrate cleaning components and methods in a plating system
#35 | 2019-06-13Electroplating dynamic edge control
#36 | 2019-05-23Electroplating apparatus with electrolyte agitation
#37 | 2018-11-29Apparatus and methods to improve ALD uniformity
#38 | 2018-10-18Microelectronic substrate electro processing system
#39 | 2018-09-27HIGH PERFORMANCE FLOW BATTERY
#40 | 2018-08-02APPARATUS FOR POST EXPOSURE BAKE
#41 | 2018-04-19Apparatus for post exposure bake
#42 | 2018-01-04Apparatus for post exposure bake
#43 | 2017-12-14Removing photoresist from a wafer
#44 | 2017-11-23Electroplating apparatus with current crowding adapted contact ring seal and thief electrode
#45 | 2017-10-05Electroplating wafers having a pattern induced non-uniformity
#46 | 2017-09-28Electroplating contact ring with radially offset contact fingers
#47 | 2017-05-25Seal rings in electrochemical processors
#48 | 2017-05-18Inert anode electroplating processor and replenisher with anionic membranes
#49 | 2017-03-02Electroplating processor with current thief electrode
#50 | 2017-02-23Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
#51 | 2017-01-26Electroplating apparatus with electrolyte agitation
#52 | 2017-01-19Inert anode electroplating processor and replenisher
#53 | 2017-01-12Electroplating apparatus with membrane tube shield
#54 | 2016-12-01Electroplating apparatus
#55 | 2016-10-20Electroplating wafers having a notch
#56 | 2016-08-18ELECTROPLATING WITH REDUCED AIR BUBBLE DEFECTS
#57 | 2016-07-28Electroplating apparatus with notch adapted contact ring seal and thief electrode
#58 | 2016-07-21Electroplating apparatus with membrane tube shield
#59 | 2015-03-19ELECTROPLATING PROCESSOR WITH GEOMETRIC ELECTROLYTE FLOW PATH
#60 | 2015-03-12Anneal module for semiconductor wafers
#61 | 2014-12-18AUTOMATIC IN-SITU CONTROL OF AN ELECTRO-PLATING PROCESSOR
#62 | 2014-12-11High performance flow battery
#63 | 2014-12-04Flow battery systems
#64 | 2014-09-18DETECTING ELECTROLYTE MENISCUS IN ELECTROPLATING PROCESSORS
#65 | 2014-03-06Electroplating systems and methods for high sheet resistance substrates
#66 | 2013-11-21SEAL RINGS IN ELECTROCHEMICAL PROCESSORS
#67 | 2013-11-14Electrochemical processor
#68 | 2013-11-14Electroplating processor with geometric electrolyte flow path
#69 | 2013-06-13Electro processor with shielded contact ring
#70 | 2013-05-30Contact ring for an electrochemical processor
#71 | 2013-03-28APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS
#72 | 2013-01-31HIGH PERFORMANCE FLOW BATTERY
#73 | 2012-11-22Electrochemical processor
#74 | 2012-11-22Electrochemical processor
#75 | 2012-08-09PROCESSING APPARATUS WITH VERTICAL LIQUID AGITATION
#76 | 2012-03-01Flow battery systems
#77 | 2012-03-01WORKPIECE WETTING AND CLEANING
#78 | 2011-10-06HIGH PERFORMANCE FLOW BATTERY
#79 | 2011-02-24Apparatus and methods for electrochemical processing of microfeature wafers
#80 | 2010-05-13Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#81 | 2010-04-01Electro-chemical processor
#82 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#83 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES
#84 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#85 | 2008-07-31Apparatus and methods for electrochemical processing of microfeature wafers
#86 | 2008-07-01Integrated microfeature workpiece processing tools with registration systems for paddle reactors
#87 | 2008-02-28Electro-chemical processor
#88 | 2008-01-17Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#89 | 2008-01-17Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
#90 | 2008-01-10Thermal wafer processor
#91 | 2008-01-03Electro-chemical processor
#92 | 2007-11-15Reactors, systems, and methods for electroplating microfeature workpieces
#93 | 2007-09-27TUNING ELECTRODES USED IN A REACTOR FOR ELECTROCHEMICALLY PROCESSING A MICROELECTRONIC WORKPIECE
#94 | 2007-09-11Workpiece processor having processing chamber with improved processing fluid flow
#95 | 2007-09-04Apparatus and methods for electrochemical processing of microelectronic workpieces
#96 | 2007-08-07Apparatus and method for thermally controlled processing of microelectronic workpieces
#97 | 2007-07-24Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#98 | 2007-07-05Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
#99 | 2007-04-26Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#100 | 2007-03-13Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
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