Inventor profile of:

Stefan Flachowsky

City:

Dresden

Country:

Germany

Published Applications:

151

Last publication date:

2018-05-31

Top Assignees for applications by Stefan Flachowsky

The entities that hold a legal rights for patent applications filed by inventor Flachowsky Stefan:

Recent patent applications by Flachowsky Stefan

Stefan Flachowsky from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-05-31
US20180151577A1
Electricity

Device including a floating gate electrode and a layer of ferroelectric material and method for the formation thereof

#2 | 2018-02-22
US20180053832A1
Electricity

NVM device in SOI technology and method of fabricating an according device

#3 | 2018-02-08
US20180040731A1
Electricity

Semiconductor-on-insulator wafer, semiconductor structure including a transistor, and methods for the formation and operation thereof

#4 | 2017-11-23
US20170338350A1
Electricity

SEMICONDUCTOR DEVICE AND METHOD

#5 | 2017-07-13
US20170200743A1
Electricity

Semiconductor structure including a first transistor and a second transistor

#6 | 2017-01-26
US20170025442A1
Electricity

Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor

#7 | 2016-12-08
US20160358915A1
Electricity

Ferroelectric FinFET

#8 | 2016-10-27
US20160315162A1
Electricity

CONTACT GEOMETRY HAVING A GATE SILICON LENGTH DECOUPLED FROM A TRANSISTOR LENGTH

#9 | 2016-10-13
US20160300928A1
Electricity

DENSELY PACKED TRANSISTOR DEVICES

#10 | 2016-09-15
US20160268426A1
Electricity

Three-dimensional transistor with improved channel mobility

#11 | 2016-09-15
US20160268271A1
Electricity

Method of forming a device including a floating gate electrode and a layer of ferroelectric material

#12 | 2016-09-08
US20160260714A1
Electricity

Ferroelectric FinFET

#13 | 2016-09-01
US20160254382A1
Electricity

Integrated circuits with fets having nanowires and methods of manufacturing the same

#14 | 2016-08-11
US20160233318A1
Electricity

Methods of forming a complex GAA FET device at advanced technology nodes

#15 | 2016-07-14
US20160204217A1
Electricity

DEVICES WITH FULLY AND PARTIALLY SILICIDED GATE STRUCTURES IN GATE FIRST CMOS TECHNOLOGIES

#16 | 2016-06-09
US20160163815A1
Electricity

Method of forming a semiconductor device structure and such a semiconductor device structure

#17 | 2016-05-19
US20160141393A1
Electricity

MEANDER RESISTOR

#18 | 2016-05-05
US20160126146A1
Electricity

Efficient main spacer pull back process for advanced VLSI CMOS technologies

#19 | 2016-04-28
US20160118483A1
Electricity

Multi-gate FETs having corrugated semiconductor stacks and method of forming the same

#20 | 2016-03-10
US20160071947A1
Electricity

METHOD INCLUDING A REPLACEMENT OF A DUMMY GATE STRUCTURE WITH A GATE STRUCTURE INCLUDING A FERROELECTRIC MATERIAL

#21 | 2016-03-10
US20160071886A1
Electricity

Highly conformal extension doping in advanced multi-gate devices

#22 | 2016-03-10
US20160071731A1
Electricity

FINFET doping method with curvilnear trajectory implantation beam path

#23 | 2016-03-03
US20160064515A1
Electricity

Methods of making integrated circuits and components thereof

#24 | 2016-03-03
US20160064510A1
Electricity

DEVICE INCLUDING A FLOATING GATE ELECTRODE AND A LAYER OF FERROELECTRIC MATERIAL AND METHOD FOR THE FORMATION THEREOF

#25 | 2016-03-03
US20160064382A1
Electricity

Selective FuSi gate formation in gate first CMOS technologies

#26 | 2016-03-03
US20160064123A1
Electricity

Temperature independent resistor

#27 | 2016-02-18
US20160049494A1
Electricity

Forming transistors without spacers and resulting devices

#28 | 2016-02-04
US20160035818A1
Electricity

FORMING A VERTICAL CAPACITOR AND RESULTING DEVICE

#29 | 2015-12-24
US20150372100A1
Electricity

INTEGRATED CIRCUITS HAVING IMPROVED CONTACTS AND METHODS FOR FABRICATING SAME

#30 | 2015-12-03
US20150348849A1
Electricity

Transistor with embedded stress-inducing layers

#31 | 2015-11-26
US20150340380A1
Electricity

INTEGRATED CIRCUIT INCLUDING A SEMICONDUCTOR-ON-INSULATOR REGION AND A BULK REGION

#32 | 2015-11-26
US20150340362A1
Electricity

Transistor devices with high-k insulation layers

#33 | 2015-11-19
US20150333080A1
Electricity

Integrated circuits and methods for operating integrated circuits with non-volatile memory

#34 | 2015-11-19
US20150333057A1
Electricity

MEANDER RESISTOR

#35 | 2015-09-08
US14302880
Electricity

Integrated inductor

#36 | 2015-08-27
US20150243787A1
Electricity

Method for a uniform compressive strain layer and device thereof

#37 | 2015-07-30
US20150214121A1
Electricity

ULTRATHIN BODY FULLY DEPLETED SILICON-ON-INSULATOR INTEGRATED CIRCUITS AND METHODS FOR FABRICATING SAME

#38 | 2015-07-30
US20150214116A1
Electricity

LOW LEAKAGE PMOS TRANSISTOR

#39 | 2015-07-16
US20150200270A1
Electricity

FIELD EFFECT TRANSISTORS FOR HIGH-PERFORMANCE AND LOW-POWER APPLICATIONS

#40 | 2015-06-25
US20150179753A1
Electricity

E-fuse design for high-K metal-gate technology

#41 | 2015-06-11
US20150162439A1
Electricity

SEMICONDUCTOR DEVICE INCLUDING A TRANSISTOR HAVING A LOW DOPED DRIFT REGION AND METHOD FOR THE FORMATION THEREOF

#42 | 2015-06-11
US20150162414A1
Electricity

Sandwich silicidation for fully silicided gate formation

#43 | 2015-05-14
US20150129966A1
Electricity

Transistor including a gate electrode extending all around one or more channel regions

#44 | 2015-05-14
US20150129964A1
Electricity

Methods of forming a nanowire transistor device

#45 | 2015-04-23
US20150111349A1
Electricity

Semiconductor structure including a semiconductor-on-insulator region and a bulk region, and method for the formation thereof

#46 | 2015-04-16
US20150102426A1
Electricity

Three-dimensional transistor with improved channel mobility

#47 | 2015-04-09
US20150097252A1
Electricity

Simplified gate-first HKMG manufacturing flow

#48 | 2015-02-26
US20150054072A1
Electricity

LATE IN-SITU DOPED SIGE JUNCTIONS FOR PMOS DEVICES ON 28 NM LOW POWER/HIGH PERFORMANCE TECHNOLOGIES USING A SILICON OXIDE ENCAPSULATION, EARLY HALO AND EXTENSION IMPLANTATIONS

#49 | 2015-02-19
US20150050787A1
Electricity

Fully silicided gate formed according to the gate-first HKMG approach

#50 | 2015-01-22
US20150021712A1
Electricity

Highly conformal extension doping in advanced multi-gate devices

#51 | 2015-01-22
US20150021693A1
Electricity

Enhancing transistor performance and reliability by incorporating deuterium into a strained capping layer

#52 | 2014-12-11
US20140361335A1
Electricity

Device including a transistor having a stressed channel region and method for the formation thereof

#53 | 2014-12-04
US20140357042A1
Electricity

Spacer stress relaxation

#54 | 2014-10-30
US20140319620A1
Electricity

Methods for fabricating integrated circuits with polycrystalline silicon resistor structures using a replacment gate process flow, and the integrated circuits fabricated thereby

#55 | 2014-09-30
US14021525
-

Silicidation of semiconductor devices

#56 | 2014-09-18
US20140273370A1
Electricity

Technique for manufacturing semiconductor devices comprising transistors with different threshold voltages

#57 | 2014-09-18
US20140273367A1
Electricity

Integrated circuits and methods for fabricating integrated circuits with gate electrode structure protection

#58 | 2014-09-18
US20140269060A1
Electricity

Integrated circuits and methods for operating integrated circuits with non-volatile memory

#59 | 2014-09-11
US20140256135A1
Electricity

Methods of removing gate cap layers in CMOS applications

#60 | 2014-09-11
US20140252557A1
Electricity

Method for forming a semiconductor device and semiconductor device structures

#61 | 2014-09-11
US20140252481A1
Electricity

Transistor including a gate electrode extending all around one or more channel regions

#62 | 2014-09-11
US20140252429A1
Electricity

Contact geometry having a gate silicon length decoupled from a transistor length

#63 | 2014-09-04
US20140248749A1
Electricity

STRESS MEMORIZATION TECHNIQUE

#64 | 2014-09-04
US20140246698A1
Electricity

Channel SiGe removal from PFET source/drain region for improved silicide formation in HKMG technologies without embedded SiGe

#65 | 2014-09-04
US20140246696A1
Electricity

TRANSISTOR WITH EMBEDDED STRAIN-INDUCING MATERIAL FORMED IN CAVITIES FORMED IN A SILICON/GERMANIUM SUBSTRATE

#66 | 2014-08-21
US20140231907A1
Electricity

Methods of inducing a desired stress in the channel region of a transistor by performing ion implantation/anneal processes on the gate electrode

#67 | 2014-08-07
US20140220759A1
Electricity

Methods for fabricating integrated circuits having gate to active and gate to gate interconnects

#68 | 2014-07-24
US20140206157A1
Electricity

Method of forming a semiconductor structure including a vertical nanowire

#69 | 2014-07-17
US20140197498A1
Electricity

Integrated circuits and methods for fabricating integrated circuits with improved silicide contacts

#70 | 2014-07-03
US20140183654A1
Electricity

Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations

#71 | 2014-06-26
US20140175539A1
Electricity

Canyon gate transistor and methods for its fabrication

#72 | 2014-06-05
US20140151818A1
Electricity

SEMICONDUCTOR DEVICE WITH A SILICON DIOXIDE GATE INSULATION LAYER IMPLANTED WITH A RARE EARTH ELEMENT AND METHODS OF MAKING SUCH A DEVICE

#73 | 2014-05-27
US13747972
-

Semiconductor device structure and methods for forming a CMOS integrated circuit structure

#74 | 2014-05-15
US20140131771A1
Electricity

Semiconductor structure including a semiconductor-on-insulator region and a bulk region, and method for the formation thereof

#75 | 2014-05-15
US20140131735A1
Electricity

Source and drain doping using doped raised source and drain regions

#76 | 2014-05-01
US20140117418A1
Electricity

THREE-DIMENSIONAL SILICON-BASED TRANSISTOR COMPRISING A HIGH-MOBILITY CHANNEL FORMED BY NON-MASKED EPITAXY

#77 | 2014-03-13
US20140070321A1
Electricity

INTEGRATED CIRCUITS HAVING BORON-DOPED SILICON GERMANIUM CHANNELS AND METHODS FOR FABRICATING THE SAME

#78 | 2014-02-13
US20140042550A1
Electricity

Integrated circuits with improved spacers and methods for fabricating same

#79 | 2014-01-30
US20140030876A1
Electricity

METHODS FOR FABRICATING HIGH CARRIER MOBILITY FINFET STRUCTURES

#80 | 2014-01-30
US20140027859A1
Electricity

Methods of forming transistor devices with high-k insulation layers and the resulting devices

#81 | 2014-01-30
US20140027825A1
Electricity

Threshold voltage adjustment in a fin transistor by corner implantation

#82 | 2014-01-16
US20140015060A1
Electricity

Stress enhanced CMOS circuits and methods for their manufacture

#83 | 2014-01-16
US20140015055A1
Electricity

Replacement gate FinFET structures with high mobility channel

#84 | 2013-12-26
US20130341722A1
Electricity

Ultrathin body fully depleted silicon-on-insulator integrated circuits and methods for fabricating same

#85 | 2013-12-19
US20130334604A1
Electricity

SOI semiconductor device comprising a substrate diode and a film diode formed by using a common well implantation mask

#86 | 2013-12-05
US20130323892A1
Electricity

Methods of performing highly tilted halo implantation processes on semiconductor devices

#87 | 2013-12-05
US20130320450A1
Electricity

Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations

#88 | 2013-12-05
US20130320449A1
Electricity

Late in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations

#89 | 2013-12-05
US20130320415A1
Electricity

Full silicidation prevention via dual nickel deposition approach

#90 | 2013-11-28
US20130313572A1
Electricity

Semiconductor device with strain-inducing regions and method thereof

#91 | 2013-11-14
US20130302956A1
Electricity

Methods of forming semiconductor devices with embedded semiconductor material as source/drain regions using a reduced number of spacers

#92 | 2013-11-07
US20130292774A1
Electricity

METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING RAISED DRAIN AND SOURCE REGIONS AND CORRESPONDING SEMICONDUCTOR DEVICE

#93 | 2013-10-24
US20130277746A1
Electricity

Integrated circuits having protruding source and drain regions and methods for forming integrated circuits

#94 | 2013-10-10
US20130267078A1
Electricity

Processes for preparing stressed semiconductor wafers and for preparing devices including the stressed semiconductor wafers

#95 | 2013-10-03
US20130256901A1
Electricity

Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts

#96 | 2013-09-19
US20130244437A1
Electricity

METHODS OF FORMING FEATURES ON AN INTEGRATED CIRCUIT PRODUCT USING A NOVEL COMPOUND SIDEWALL IMAGE TRANSFER TECHNIQUE

#97 | 2013-09-19
US20130244388A1
Electricity

METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH REDUCED ELECTRICAL PARAMETER VARIATION

#98 | 2013-08-15
US20130207275A1
Electricity

Methods of Forming Device Level Conductive Contacts to Improve Device Performance and Semiconductor Devices Comprising Such Contacts

#99 | 2013-08-01
US20130196495A1
Electricity

Methods for fabricating MOS devices with stress memorization

#100 | 2013-07-25
US20130187209A1
Electricity

Semiconductor devices having encapsulated stressor regions and related fabrication methods

InventorID:

67231 ⎘