Dresden
Germany
151
2018-05-31
The entities that hold a legal rights for patent applications filed by inventor Flachowsky Stefan:
Stefan Flachowsky from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Device including a floating gate electrode and a layer of ferroelectric material and method for the formation thereof
#2 | 2018-02-22NVM device in SOI technology and method of fabricating an according device
#3 | 2018-02-08Semiconductor-on-insulator wafer, semiconductor structure including a transistor, and methods for the formation and operation thereof
#4 | 2017-11-23SEMICONDUCTOR DEVICE AND METHOD
#5 | 2017-07-13Semiconductor structure including a first transistor and a second transistor
#6 | 2017-01-26Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor
#7 | 2016-12-08Ferroelectric FinFET
#8 | 2016-10-27CONTACT GEOMETRY HAVING A GATE SILICON LENGTH DECOUPLED FROM A TRANSISTOR LENGTH
#9 | 2016-10-13DENSELY PACKED TRANSISTOR DEVICES
#10 | 2016-09-15Three-dimensional transistor with improved channel mobility
#11 | 2016-09-15Method of forming a device including a floating gate electrode and a layer of ferroelectric material
#12 | 2016-09-08Ferroelectric FinFET
#13 | 2016-09-01Integrated circuits with fets having nanowires and methods of manufacturing the same
#14 | 2016-08-11Methods of forming a complex GAA FET device at advanced technology nodes
#15 | 2016-07-14DEVICES WITH FULLY AND PARTIALLY SILICIDED GATE STRUCTURES IN GATE FIRST CMOS TECHNOLOGIES
#16 | 2016-06-09Method of forming a semiconductor device structure and such a semiconductor device structure
#17 | 2016-05-19MEANDER RESISTOR
#18 | 2016-05-05Efficient main spacer pull back process for advanced VLSI CMOS technologies
#19 | 2016-04-28Multi-gate FETs having corrugated semiconductor stacks and method of forming the same
#20 | 2016-03-10METHOD INCLUDING A REPLACEMENT OF A DUMMY GATE STRUCTURE WITH A GATE STRUCTURE INCLUDING A FERROELECTRIC MATERIAL
#21 | 2016-03-10Highly conformal extension doping in advanced multi-gate devices
#22 | 2016-03-10FINFET doping method with curvilnear trajectory implantation beam path
#23 | 2016-03-03Methods of making integrated circuits and components thereof
#24 | 2016-03-03DEVICE INCLUDING A FLOATING GATE ELECTRODE AND A LAYER OF FERROELECTRIC MATERIAL AND METHOD FOR THE FORMATION THEREOF
#25 | 2016-03-03Selective FuSi gate formation in gate first CMOS technologies
#26 | 2016-03-03Temperature independent resistor
#27 | 2016-02-18Forming transistors without spacers and resulting devices
#28 | 2016-02-04FORMING A VERTICAL CAPACITOR AND RESULTING DEVICE
#29 | 2015-12-24INTEGRATED CIRCUITS HAVING IMPROVED CONTACTS AND METHODS FOR FABRICATING SAME
#30 | 2015-12-03Transistor with embedded stress-inducing layers
#31 | 2015-11-26INTEGRATED CIRCUIT INCLUDING A SEMICONDUCTOR-ON-INSULATOR REGION AND A BULK REGION
#32 | 2015-11-26Transistor devices with high-k insulation layers
#33 | 2015-11-19Integrated circuits and methods for operating integrated circuits with non-volatile memory
#34 | 2015-11-19MEANDER RESISTOR
#35 | 2015-09-08Integrated inductor
#36 | 2015-08-27Method for a uniform compressive strain layer and device thereof
#37 | 2015-07-30ULTRATHIN BODY FULLY DEPLETED SILICON-ON-INSULATOR INTEGRATED CIRCUITS AND METHODS FOR FABRICATING SAME
#38 | 2015-07-30LOW LEAKAGE PMOS TRANSISTOR
#39 | 2015-07-16FIELD EFFECT TRANSISTORS FOR HIGH-PERFORMANCE AND LOW-POWER APPLICATIONS
#40 | 2015-06-25E-fuse design for high-K metal-gate technology
#41 | 2015-06-11SEMICONDUCTOR DEVICE INCLUDING A TRANSISTOR HAVING A LOW DOPED DRIFT REGION AND METHOD FOR THE FORMATION THEREOF
#42 | 2015-06-11Sandwich silicidation for fully silicided gate formation
#43 | 2015-05-14Transistor including a gate electrode extending all around one or more channel regions
#44 | 2015-05-14Methods of forming a nanowire transistor device
#45 | 2015-04-23Semiconductor structure including a semiconductor-on-insulator region and a bulk region, and method for the formation thereof
#46 | 2015-04-16Three-dimensional transistor with improved channel mobility
#47 | 2015-04-09Simplified gate-first HKMG manufacturing flow
#48 | 2015-02-26LATE IN-SITU DOPED SIGE JUNCTIONS FOR PMOS DEVICES ON 28 NM LOW POWER/HIGH PERFORMANCE TECHNOLOGIES USING A SILICON OXIDE ENCAPSULATION, EARLY HALO AND EXTENSION IMPLANTATIONS
#49 | 2015-02-19Fully silicided gate formed according to the gate-first HKMG approach
#50 | 2015-01-22Highly conformal extension doping in advanced multi-gate devices
#51 | 2015-01-22Enhancing transistor performance and reliability by incorporating deuterium into a strained capping layer
#52 | 2014-12-11Device including a transistor having a stressed channel region and method for the formation thereof
#53 | 2014-12-04Spacer stress relaxation
#54 | 2014-10-30Methods for fabricating integrated circuits with polycrystalline silicon resistor structures using a replacment gate process flow, and the integrated circuits fabricated thereby
#55 | 2014-09-30Silicidation of semiconductor devices
#56 | 2014-09-18Technique for manufacturing semiconductor devices comprising transistors with different threshold voltages
#57 | 2014-09-18Integrated circuits and methods for fabricating integrated circuits with gate electrode structure protection
#58 | 2014-09-18Integrated circuits and methods for operating integrated circuits with non-volatile memory
#59 | 2014-09-11Methods of removing gate cap layers in CMOS applications
#60 | 2014-09-11Method for forming a semiconductor device and semiconductor device structures
#61 | 2014-09-11Transistor including a gate electrode extending all around one or more channel regions
#62 | 2014-09-11Contact geometry having a gate silicon length decoupled from a transistor length
#63 | 2014-09-04STRESS MEMORIZATION TECHNIQUE
#64 | 2014-09-04Channel SiGe removal from PFET source/drain region for improved silicide formation in HKMG technologies without embedded SiGe
#65 | 2014-09-04TRANSISTOR WITH EMBEDDED STRAIN-INDUCING MATERIAL FORMED IN CAVITIES FORMED IN A SILICON/GERMANIUM SUBSTRATE
#66 | 2014-08-21Methods of inducing a desired stress in the channel region of a transistor by performing ion implantation/anneal processes on the gate electrode
#67 | 2014-08-07Methods for fabricating integrated circuits having gate to active and gate to gate interconnects
#68 | 2014-07-24Method of forming a semiconductor structure including a vertical nanowire
#69 | 2014-07-17Integrated circuits and methods for fabricating integrated circuits with improved silicide contacts
#70 | 2014-07-03Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations
#71 | 2014-06-26Canyon gate transistor and methods for its fabrication
#72 | 2014-06-05SEMICONDUCTOR DEVICE WITH A SILICON DIOXIDE GATE INSULATION LAYER IMPLANTED WITH A RARE EARTH ELEMENT AND METHODS OF MAKING SUCH A DEVICE
#73 | 2014-05-27Semiconductor device structure and methods for forming a CMOS integrated circuit structure
#74 | 2014-05-15Semiconductor structure including a semiconductor-on-insulator region and a bulk region, and method for the formation thereof
#75 | 2014-05-15Source and drain doping using doped raised source and drain regions
#76 | 2014-05-01THREE-DIMENSIONAL SILICON-BASED TRANSISTOR COMPRISING A HIGH-MOBILITY CHANNEL FORMED BY NON-MASKED EPITAXY
#77 | 2014-03-13INTEGRATED CIRCUITS HAVING BORON-DOPED SILICON GERMANIUM CHANNELS AND METHODS FOR FABRICATING THE SAME
#78 | 2014-02-13Integrated circuits with improved spacers and methods for fabricating same
#79 | 2014-01-30METHODS FOR FABRICATING HIGH CARRIER MOBILITY FINFET STRUCTURES
#80 | 2014-01-30Methods of forming transistor devices with high-k insulation layers and the resulting devices
#81 | 2014-01-30Threshold voltage adjustment in a fin transistor by corner implantation
#82 | 2014-01-16Stress enhanced CMOS circuits and methods for their manufacture
#83 | 2014-01-16Replacement gate FinFET structures with high mobility channel
#84 | 2013-12-26Ultrathin body fully depleted silicon-on-insulator integrated circuits and methods for fabricating same
#85 | 2013-12-19SOI semiconductor device comprising a substrate diode and a film diode formed by using a common well implantation mask
#86 | 2013-12-05Methods of performing highly tilted halo implantation processes on semiconductor devices
#87 | 2013-12-05Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations
#88 | 2013-12-05Late in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations
#89 | 2013-12-05Full silicidation prevention via dual nickel deposition approach
#90 | 2013-11-28Semiconductor device with strain-inducing regions and method thereof
#91 | 2013-11-14Methods of forming semiconductor devices with embedded semiconductor material as source/drain regions using a reduced number of spacers
#92 | 2013-11-07METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING RAISED DRAIN AND SOURCE REGIONS AND CORRESPONDING SEMICONDUCTOR DEVICE
#93 | 2013-10-24Integrated circuits having protruding source and drain regions and methods for forming integrated circuits
#94 | 2013-10-10Processes for preparing stressed semiconductor wafers and for preparing devices including the stressed semiconductor wafers
#95 | 2013-10-03Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts
#96 | 2013-09-19METHODS OF FORMING FEATURES ON AN INTEGRATED CIRCUIT PRODUCT USING A NOVEL COMPOUND SIDEWALL IMAGE TRANSFER TECHNIQUE
#97 | 2013-09-19METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH REDUCED ELECTRICAL PARAMETER VARIATION
#98 | 2013-08-15Methods of Forming Device Level Conductive Contacts to Improve Device Performance and Semiconductor Devices Comprising Such Contacts
#99 | 2013-08-01Methods for fabricating MOS devices with stress memorization
#100 | 2013-07-25Semiconductor devices having encapsulated stressor regions and related fabrication methods
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