San Jose, California
United States
43
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Workman Thomas:
Thomas Workman from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
HYBRID BONDING WITH MIXED PITCH CONTACT PADS
#2 | 2026-05-14STACKED ELECTRONIC DEVICES
#3 | 2026-05-07INTEGRATED TEMPERATURE CONTROL SYSTEM FOR SUBASSEMBLIES
#4 | 2026-02-19PROBE CARDS AND METHODS RELATED THERETO
#5 | 2026-02-12STRUCTURES AND METHODS FOR BONDING DIES
#6 | 2026-01-15EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#7 | 2025-12-25COMPOSITE HYBRID STRUCTURES
#8 | 2025-10-02HOTSPOT MITIGATION IN FLUID COOLING
#9 | 2025-10-02THERMAL IMPROVEMENT SYSTEMS FOR ELECTRONIC DEVICES AND METHODS OF FORMING THE SAME
#10 | 2025-09-18ELECTRONIC DEVICE COOLING STRUCTURES BONDED TO SEMICONDUCTOR ELEMENTS
#11 | 2025-08-21DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS
#12 | 2025-08-07INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#13 | 2025-07-10EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS
#14 | 2025-07-03DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMING THE SAME
#15 | 2025-06-26TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER
#16 | 2025-06-26EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#17 | 2025-03-06METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING
#18 | 2025-02-13ELECTRONIC DEVICE COOLING STRUCTURES
#19 | 2025-01-02STRUCTURES AND METHODS FOR BONDING DIES
#20 | 2025-01-02APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE AND METHODS OF USING THE SAME
#21 | 2024-11-21DIRECT GANG BONDING METHODS AND STRUCTURES
#22 | 2024-10-03TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS
#23 | 2024-08-08ELECTRONIC DEVICE COOLING STRUCTURES
#24 | 2024-07-04DEBONDING REPAIR DEVICES
#25 | 2024-06-20Direct bonded stack structures for increased reliability and improved yield in microelectronics
#26 | 2024-03-28BONDED STRUCTURE AND METHOD OF FORMING SAME
#27 | 2024-03-21APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING THE SAME
#28 | 2024-03-07RAPID THERMAL PROCESSING FOR DIRECT BONDING
#29 | 2024-02-15BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME
#30 | 2024-02-01Embedded cooling systems and methods of manufacturing embedded cooling systems
#31 | 2023-11-09LOW TEMPERATURE DIRECT BONDING
#32 | 2023-09-21EXPANSION CONTROL FOR BONDING
#33 | 2023-08-24BONDED STRUCTURES
#34 | 2023-06-29APPARATUSES AND METHODS FOR DIE BOND CONTROL
#35 | 2023-06-29BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
#36 | 2023-05-11STACKED ELECTRONIC DEVICES
#37 | 2023-04-13METHOD OF BONDING THIN SUBSTRATES
#38 | 2022-10-06DIRECT BONDING METHODS AND STRUCTURES
#39 | 2022-09-15Direct bonded stack structures for increased reliability and improved yield in microelectronics
#40 | 2021-04-01Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
#41 | 2020-12-31Direct bonded stack structures for increased reliability and improved yield in microelectronics
#42 | 2014-03-20Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes
#43 | 2006-08-15Electronic assembly comprising solderable thermal interface and methods of manufacture
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