Hsinchu
Taiwan
52
2012-11-08
21
2014-04-29
These are the the leading inventors for applications assigned to PHOENIX PRECISION TECHNOLOGY CORPORATION:
PHOENIX PRECISION TECHNOLOGY CORPORATION based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Circuit board having semiconductor chip embedded therein
#2 | 2010-04-22Packaging substrate
#3 | 2010-04-15Electrical connection element of packaging substrate
#4 | 2009-12-03Packaging substrate structure
#5 | 2009-09-24 ✅ Patent 8,058,723 granted on 2011-11-15Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof
#6 | 2009-05-07Stacked package module and method for fabricating the same
#7 | 2009-04-23Packaging substrate having capacitor embedded therein
#8 | 2009-04-23Package on package structure
#9 | 2009-04-02Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof
#10 | 2009-03-26Circuit board structure with capacitor embedded therein and method for fabricating the same
#11 | 2009-03-19PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#12 | 2009-03-12 ✅ Patent 8,158,891 granted on 2012-04-17Circuit board structure and method for manufacturing the same
#13 | 2009-03-05 ✅ Patent 8,022,513 granted on 2011-09-20Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same
#14 | 2009-03-05 ✅ Patent 8,436,463 granted on 2013-05-07Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
#15 | 2009-02-19 ✅ Patent 7,754,538 granted on 2010-07-13Packaging substrate structure with electronic components embedded therein and method for manufacturing the same
#16 | 2009-02-12Packaging substrate and application thereof
#17 | 2009-02-05PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF
#18 | 2009-01-29Flip chip package structure and method for manufacturing the same
#19 | 2009-01-15Flip-chip package structure, and the substrate and the chip thereof
#20 | 2008-12-18Structure of packaging substrate having capacitor embedded therein and method for fabricating the same
#21 | 2008-10-30Structure of packaging substrate and method for making the same
#22 | 2008-10-23Packaging substrate and method for manufacturing the same
#23 | 2008-10-16Structure of semiconductor chip and package structure having semiconductor chip embedded therein
#24 | 2008-10-09 ✅ Patent 7,968,991 granted on 2011-06-28Stacked package module and board having exposed ends
#25 | 2008-10-02Packaging substrate structure
#26 | 2008-09-25Chip package module
#27 | 2008-09-25Stacked package module
#28 | 2008-09-25Flip-chip substrate
#29 | 2008-09-18Package structure and stacked package module using the same
#30 | 2008-09-11Semiconductor packaging substrate structure with capacitor embedded therein
#31 | 2008-09-04 ✅ Patent 8,256,106 granted on 2012-09-04Method for fabricating circuit board structure with capacitors embedded therein
#32 | 2008-08-14 ✅ Patent 7,754,598 granted on 2010-07-13Method for manufacturing coreless packaging substrate
#33 | 2008-08-07Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
#34 | 2008-07-31 ✅ Patent 7,582,961 granted on 2009-09-01Package structure with circuits directly connected to semiconductor chip
#35 | 2008-07-10 ✅ Patent 7,598,610 granted on 2009-10-06Plate structure having chip embedded therein and the manufacturing method of the same
#36 | 2008-06-26 ✅ Patent 7,829,987 granted on 2010-11-09Carrier structure embedded with semiconductor chips and method for manufacturing the same
#37 | 2008-06-05 ✅ Patent 7,768,119 granted on 2010-08-03Carrier structure embedded with semiconductor chip
#38 | 2008-05-29PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#39 | 2008-05-22 ✅ Patent 7,619,317 granted on 2009-11-17Carrier structure for semiconductor chip and method for manufacturing the same
#40 | 2008-04-24Substrate with surface finished structure and method for making the same
#41 | 2008-03-27 ✅ Patent 7,820,233 granted on 2010-10-26Method for fabricating a flip chip substrate structure
#42 | 2008-03-13Flip chip substrate structure and the method for manufacturing the same
#43 | 2008-02-14Conductive connection structure formed on the surface of circuit board and manufacturing method thereof
#44 | 2008-02-07Circuit board structure with capacitors embedded therein and method for fabricating the same
#45 | 2008-02-07 ✅ Patent 7,867,888 granted on 2011-01-11Flip-chip package substrate and a method for fabricating the same
#46 | 2008-02-07Plate structure having chip embedded therein and the manufacturing method of the same
#47 | 2008-01-31 ✅ Patent 7,705,446 granted on 2010-04-27Package structure having semiconductor chip embedded therein and method for fabricating the same
#48 | 2007-10-25 ✅ Patent 7,435,618 granted on 2008-10-14Method to manufacture a coreless packaging substrate
#49 | 2007-10-25 ✅ Patent 7,419,850 granted on 2008-09-02Method to manufacture a coreless packaging substrate
#50 | 2007-10-25 ✅ Patent 7,626,270 granted on 2009-12-01Coreless package substrate with conductive structures
#51 | 2007-03-01 ✅ Patent 7,450,793 granted on 2008-11-11Semiconductor device integrated with opto-electric component and method for fabricating the same
#52 | 2006-09-14FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME
193090 ⎘