Michael D. Willwerth

INDUCTIVELY COUPLED PLASMA CHAMBER WITH ELECTRICALLY POWERED MAGNET RING

#2 | 2026-01-08

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CAPACITIVE SENSORS AND CAPACITIVE SENSING LOCATIONS FOR PLASMA CHAMBER CONDITION MONITORING

#3 | 2024-09-26

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SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR

#4 | 2023-10-26

US20230343568A2

CAPACITIVE SENSING DATA INTEGRATION FOR PLASMA CHAMBER CONDITION MONITORING

#5 | 2023-08-17

US20230258500A1

SPATIAL OPTICAL EMISSION SPECTROSCOPY FOR ETCH UNIFORMITY

#6 | 2023-03-30

US20230103165A1

CAPACITIVE SENSING DATA INTEGRATION FOR PLASMA CHAMBER CONDITION MONITORING

#7 | 2023-03-30

US20230102933A1

Gas distribution plate with UV blocker

#8 | 2022-10-27

US20220341867A1

Capacitive sensor housing for chamber condition monitoring

#9 | 2022-10-20

US20220333989A1

Spatial optical emission spectroscopy for etch uniformity

#10 | 2022-08-18

US20220262600A1

Fast gas exchange apparatus, system, and method

#11 | 2022-05-19

US20220157574A1

RING FOR SUBSTRATE EXTREME EDGE PROTECTION

#12 | 2021-09-09

US20210280443A1

Capacitive sensor for chamber condition monitoring

#13 | 2021-09-09

US20210280400A1

Capacitive sensing data integration for plasma chamber condition monitoring

#14 | 2021-09-09

US20210280399A1

CAPACITIVE SENSORS AND CAPACITIVE SENSING LOCATIONS FOR PLASMA CHAMBER CONDITION MONITORING

#15 | 2021-09-09

US20210278360A1

Capacitive sensor housing for chamber condition monitoring

#16 | 2021-02-04

US20210035851A1

LOW CONTACT AREA SUBSTRATE SUPPORT FOR ETCHING CHAMBER

#17 | 2020-10-22

US20200335368A1

Sensors and system for in-situ edge ring erosion monitor

#18 | 2020-05-14

US20200152431A1

Processing chamber with substrate edge enhancement processing

#19 | 2020-04-16

US20200118844A1

Chamber lid with integrated heater

#20 | 2020-01-09

US20200013661A1

Electrostatic chuck with variable pixelated magnetic field

#21 | 2019-09-19

US20190287758A1

Resonant process monitor

#22 | 2019-08-08

US20190244848A1

Cooling element for an electrostatic chuck assembly

#23 | 2019-04-18

US20190115240A1

Gas flow for condensation reduction with a substrate processing chuck

#24 | 2018-04-12

US20180103508A1

Substrate support assembly

#25 | 2017-11-30

US20170345623A1

Apparatus and methods for reducing particles in semiconductor process chambers

#26 | 2017-08-03

US20170221750A1

Conductive wafer lift pin o-ring gripper with resistor

#27 | 2017-02-02

US20170032997A1

Substrate lift pin actuator

#28 | 2017-01-12

US20170011891A1

ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS RING MATERIAL

#29 | 2016-09-22

US20160276197A1

Gas flow for condensation reduction with a substrate processing chuck

#30 | 2016-09-01

US20160254123A1

Shielded lid heater assembly

#31 | 2016-05-12

US20160135252A1

Substrate support assembly having rapid temperature control

#32 | 2016-04-07

US20160099162A1

SINGLE RING DESIGN FOR HIGH YIELD, SUBSTRATE EXTREME EDGE DEFECT REDUCTION IN ICP PLASMA PROCESSING CHAMBER

#33 | 2015-08-06

US20150221481A1

ELECTROSTATIC CHUCK WITH MAGNETIC CATHODE LINER FOR CRITICAL DIMENSION (CD) TUNING

#34 | 2015-06-04

US20150155193A1

Electrostatic chuck with variable pixelated magnetic field

#35 | 2014-12-18

US20140367046A1

Enhanced plasma source for a plasma reactor

#36 | 2014-11-27

US20140345803A1

METHOD AND APPARATUS FOR STABLE PLASMA PROCESSING

#37 | 2014-09-18

US20140272211A1

Apparatus and methods for reducing particles in semiconductor process chambers

#38 | 2014-06-05

US20140151331A1

DEPOSITION SHIELD FOR PLASMA ENHANCED SUBSTRATE PROCESSING

#39 | 2013-12-26

US20130344701A1

METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE

#40 | 2013-10-31

US20130284374A1

High temperature electrostatic chuck with real-time heat zone regulating capability

#41 | 2013-10-24

US20130277339A1

Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface

#42 | 2013-07-25

US20130189848A1

Shielded lid heater assembly

#43 | 2013-05-16

US20130118687A1

Method and apparatus for stable plasma processing

#44 | 2013-02-07

US20130032478A1

Low sloped edge ring for plasma processing chamber

#45 | 2012-04-26

US20120097908A1

Low force substrate lift

#46 | 2012-02-02

US20120024479A1

Apparatus for controlling the flow of a gas in a process chamber

#47 | 2011-07-07

US20110162803A1

Chamber with uniform flow and plasma distribution

#48 | 2011-06-30

US20110157760A1

Electrostatic chuck with reduced arcing

#49 | 2011-05-26

US20110120651A1

SHOWERHEAD ASSEMBLY WITH IMPROVED IMPACT PROTECTION

#50 | 2011-03-24

US20110068082A1

Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection

#51 | 2010-05-06

US20100108263A1

EXTENDED CHAMBER LINER FOR IMPROVED MEAN TIME BETWEEN CLEANINGS OF PROCESS CHAMBERS

#52 | 2010-03-11

US20100059181A1

Low sloped edge ring for plasma processing chamber

#53 | 2010-02-04

US20100025384A1

Field enhanced inductively coupled plasma (Fe-ICP) reactor

#54 | 2009-11-05

US20090274590A1

PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MULTIZONE AC HEATER POWER TRANSMISSION THROUGH THE COAXIAL FEED

#55 | 2009-09-24

US20090236315A1

Shielded lid heater assembly

#56 | 2009-09-03

US20090221150A1

ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS RING MATERIAL

#57 | 2009-09-03

US20090221149A1

MULTIPLE PORT GAS INJECTION SYSTEM UTILIZED IN A SEMICONDUCTOR PROCESSING SYSTEM

#58 | 2009-09-03

US20090218043A1

Gas flow equalizer plate suitable for use in a substrate process chamber

#59 | 2009-03-05

US20090057269A1

Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection

#60 | 2009-03-05

US20090056629A1

Cathode liner with wafer edge gas injection in a plasma reactor chamber

#61 | 2009-01-01

US20090004870A1

Methods for high temperature etching a high-K material gate structure

#62 | 2008-03-27

US20080074658A1

Method and apparatus for performing limited area spectral analysis

#63 | 2008-01-24

US20080017104A1

Substrate processing with rapid temperature gradient control

#64 | 2007-07-05

US20070153263A1

Method and apparatus for performing limited area spectral analysis

#65 | 2006-01-05

US20060000805A1

Method and apparatus for stable plasma processing

#66 | 2005-06-23

US20050134834A1